ZPM3570-E RFM, ZPM3570-E Datasheet - Page 2

• Manufacturer Part Number: ZPM3570-E
• Description: TXRX ZIGBEE PRO MODULE
• Manufacturer: RFM
• Series: ZPMr

Specifications of ZPM3570-E

• Frequency: 2.4GHz ~ 2.5GHz
• Data Rate - Maximum: -
• Modulation Or Protocol: 802.15.4 Zigbee
• Applications: General Purpose
• Power - Output: 20dBm
• Sensitivity: -103dBm
• Voltage - Supply: 2.4 V ~ 3.4 V
• Current - Receiving: 35mA
• Current - Transmitting: 175mA
• Data Interface: Solder Pad
• Memory Size: 8Mbits
• Antenna Connector: On-Board, Chip
• Operating Temperature: -40°C ~ 85°C
• Package / Case: Module
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 583-1162

Table of Contents
1 System Description .................................................................................................................................... 4
1.1 Applications............................................................................................................................................. 4
1.2 Module Summary.................................................................................................................................... 4
1.3 Block Diagram......................................................................................................................................... 4
1.4 Acronyms ................................................................................................................................................ 5
2 Mechanical Specifications ......................................................................................................................... 5
2.1 Module Dimensions ................................................................................................................................ 5
2.2 Module Outline Drawing ......................................................................................................................... 5
2.3 Module Bottom View............................................................................................................................... 6
2.4 Detailed Mechanical Data (Top View) .................................................................................................... 6
2.5 Module Pin Out ....................................................................................................................................... 7
3 DC Electrical Specifications....................................................................................................................... 8
3.1 Typical Power Consumption ................................................................................................................... 8
3.2 Digital IO Specifications .......................................................................................................................... 8
4 RF Specifications ....................................................................................................................................... 9
5 Environmental Specifications..................................................................................................................... 9
5.1 Absolute Maximum Ratings .................................................................................................................... 9
5.2 Recommended Operating Conditions .................................................................................................... 9
6 Application Information ............................................................................................................................ 10
6.1 Connection Reference for the UART Host Interface ............................................................................ 10
6.2 Connection Reference for the SPI Host Interface ................................................................................ 10
6.3 Recommended Host (Customer) Circuit Board PCB Land Pattern...................................................... 11
6.4 Host PCB Layout Recommendations ................................................................................................... 12
6.5 Module Location ................................................................................................................................... 13
6.5.1 Location in x-y Plane ......................................................................................................................... 13
6.5.2 Location in z Plane ............................................................................................................................ 14
7 Assembly Information .............................................................................................................................. 14
7.1 Lead-free Reflow Soldering Profile ...................................................................................................... 14
8 Package Information ................................................................................................................................ 15
8.1 Tape and Reel Specifications ............................................................................................................... 15
9 Ordering Information ................................................................................................................................ 16
10 RoHS Declaration .................................................................................................................................. 16
11 Regulatory Information .......................................................................................................................... 16
11.1 FCC Notice (USA) .............................................................................................................................. 16
11.1.1 FCC Labeling Requirements ........................................................................................................... 17
11.1.2 RF Exposure .................................................................................................................................... 17
11.2 IC Notice (CANADA)........................................................................................................................... 17
11.3 CE Notice (EUROPE) ......................................................................................................................... 18
12 Technical Support Contact .................................................................................................................... 18
13 References............................................................................................................................................. 18
www.RFM.com
Technical support +1.678.684.2000
Page 2 of 18
© 2011 by RF Monolithics, Inc.
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ZPM3570 Data Sheet - 05/25/11