ZPM3570-E RFM, ZPM3570-E Datasheet - Page 3

• Manufacturer Part Number: ZPM3570-E
• Description: TXRX ZIGBEE PRO MODULE
• Manufacturer: RFM
• Series: ZPMr

Specifications of ZPM3570-E

• Frequency: 2.4GHz ~ 2.5GHz
• Data Rate - Maximum: -
• Modulation Or Protocol: 802.15.4 Zigbee
• Applications: General Purpose
• Power - Output: 20dBm
• Sensitivity: -103dBm
• Voltage - Supply: 2.4 V ~ 3.4 V
• Current - Receiving: 35mA
• Current - Transmitting: 175mA
• Data Interface: Solder Pad
• Memory Size: 8Mbits
• Antenna Connector: On-Board, Chip
• Operating Temperature: -40°C ~ 85°C
• Package / Case: Module
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 583-1162

List of Figures
Figure 1 ZPM3750 Module Block Diagram................................................................................................... 4
Figure 2 Module Top and Side View............................................................................................................. 5
Figure 3 Module Bottom View....................................................................................................................... 6
Figure 4 Detailed Mechanical Data (Top View) ............................................................................................ 6
Figure 5 UART Host Interface Reference Diagram ................................................................................... 10
Figure 6 SPI Host Interface Reference Diagram ........................................................................................ 10
Figure 7 Recommended Host (Customer) PCB Pattern............................................................................. 11
Figure 8 Recommended Host Circuit Board Design Underneath the Module............................................ 12
Figure 9 Recommended Locations in x-y Plane......................................................................................... 13
Figure 10 Locations Not Recommended in x-y Plane ................................................................................ 13
Figure 11 Recommended Locations in z Plane.......................................................................................... 14
Figure 12 Locations not Recommended IN x-y Plane ................................................................................ 14
Figure 13 Recommended Solder Reflow Profile ........................................................................................ 15
Figure 14 Tape Dimensions........................................................................................................................ 15
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ZPM3570 Data Sheet - 05/25/11