74HC4067D,652 NXP Semiconductors, 74HC4067D,652 Datasheet - Page 2

• Manufacturer Part Number: 74HC4067D,652
• Description: IC MUX/DEMUX 1X16 24SOIC
• Manufacturer: NXP Semiconductors
• Series: 74HCr

Specifications of 74HC4067D,652

• Package / Case: 24-SOIC (0.300", 7.50mm Width)
• Function: Multiplexer/Demultiplexer
• Circuit: 1 x 1:16
• On-state Resistance: 60 Ohm
• Voltage Supply Source: Single Supply
• Voltage - Supply, Single/dual (±): 2 V ~ 10 V
• Current - Supply: 16µA
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Number Of Channels: 1 Channel
• On Resistance (max): 180 Ohm @ 4.5 V
• Propagation Delay Time: 22 ns
• On Time (max): 300 ns @ 2 V
• Off Time (max): 290 ns @ 2 V
• Supply Voltage (max): 10 V
• Supply Voltage (min): 2 V
• Maximum Power Dissipation: 500 mW
• Maximum Operating Temperature: + 125 C
• Minimum Operating Temperature: - 40 C
• Mounting Style: SMD/SMT
• Number Of Switches: Single
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 568-2698-5; 933715660652

NXP Semiconductors
4. Ordering information
Table 1.
74HC_HCT4067_3
Product data sheet
Type number
74HC4067
74HC4067N
74HC4067D
74HC4067DB
74HC4067PW
74HC4067BQ
74HCT4067
74HCT4067N
74HCT4067D
74HCT4067DB
74HCT4067PW
74HCT4067BQ
Ordering information
Package
Temperature range Name
40 C to +125 C
40 C to +125 C
40 C to +125 C
40 C to +125 C
40 C to +125 C
40 C to +125 C
40 C to +125 C
40 C to +125 C
40 C to +125 C
40 C to +125 C
DIP24
SO24
SSOP24
TSSOP24
DHVQFN24 plastic dual in-line compatible thermal enhanced very
DIP24
SO24
SSOP24
TSSOP24
DHVQFN24 plastic dual in-line compatible thermal enhanced very
Rev. 03 — 15 October 2007
Description
plastic dual in-line package; 24 leads (600 mil);
reverse bending
plastic small outline package; 24 leads;
body width 7.5 mm
plastic shrink small outline package; 24 leads;
body width 5.3 mm
plastic thin shrink small outline package; 24 leads;
body width 4.4 mm
thin quad flat package; no leads; 24 terminals;
body 3.5
plastic dual in-line package; 24 leads (600 mil);
reverse bending
plastic small outline package; 24 leads;
body width 7.5 mm
plastic shrink small outline package; 24 leads;
body width 5.3 mm
plastic thin shrink small outline package; 24 leads;
body width 4.4 mm
thin quad flat package; no leads; 24 terminals;
body 3.5
5.5
5.5
74HC4067; 74HCT4067
16-channel analog multiplexer/demultiplexer
0.85 mm
0.85 mm
© NXP B.V. 2007. All rights reserved.
Version
SOT101-1
SOT137-1
SOT340-1
SOT355-1
SOT815-1
SOT101-1
SOT137-1
SOT340-1
SOT355-1
SOT815-1
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