LPC1785FBD208,551 NXP Semiconductors, LPC1785FBD208,551 Datasheet - Page 70

• Manufacturer Part Number: LPC1785FBD208,551
• Description: Processors - Application Specialized CORTEX-M3 256KB FL 80KB SRAM 4KB EE USB
• Manufacturer: NXP Semiconductors
• Series: LPC17xxr

Specifications of LPC1785FBD208,551

• Core Processor: ARM® Cortex-M3™
• Core Size: 32-Bit
• Speed: 120MHz
• Connectivity: CAN, EBI/EMI, I²C, Microwire, MMC, SPI, SSI, SSP, UART/USART, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, I²S, LCD, Motor Control PWM, POR, PWM, WDT
• Number Of I /o: 165
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Eeprom Size: 4K x 8
• Ram Size: 80K x 8
• Voltage - Supply (vcc/vdd): 2.4 V ~ 3.6 V
• Data Converters: A/D 8x12b, D/A 1x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 208-LQFP
• Lead Free Status / Rohs Status: Details
• Other names: 935291613551

NXP Semiconductors
9. Thermal characteristics
Table 10.
V
LPC178X_7X
Objective data sheet
Symbol
T
DD
j(max)
= 2.4 V to 3.6 V; T
Thermal characteristics
Parameter
maximum junction
temperature
9.1 Thermal characteristics
amb
The average chip junction temperature, T
equation:
The internal power dissipation is the product of I
the I/O pins is often small and many times can be negligible. However it can be significant
in some applications.
T
=
J
•
•
•

=
T
R
P
40
amb
D
th(j-a)
T
amb

= sum of internal and I/O power dissipation
C to +85
= ambient temperature (C),
= the package junction-to-ambient thermal resistance (C/W)
+

P
D
All information provided in this document is subject to legal disclaimers.

Conditions

C unless otherwise specified;
R
th j a

–
Rev. 2 — 27 May 2011


J
(C), can be calculated using the following
Min
-
DD
32-bit ARM Cortex-M3 microcontroller
and V
DD
Typ
-
. The I/O power dissipation of
LPC178x/7x
Max
125
© NXP B.V. 2011. All rights reserved.
Unit
70 of 117
C
(1)