TEA1521T NXP Semiconductors, TEA1521T Datasheet
TEA1521T
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TEA1521T Summary of contents
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TEA152x SMPS ICs for low-power systems Rev. 04 — 14 September 2010 1. General description The TEA152x family STARplug is a Switched Mode Power Supply (SMPS) controller IC that operates directly from the rectified universal mains implemented in ...
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... NXP Semiconductors 3. Applications Chargers Adapters Set-Top Box (STB) DVD CD(R) TV/monitor standby supplies PC peripherals Microcontroller supplies in home applications and small portable equipment, etc. 4. Quick reference data Table 1. Symbol V drain R DSon osc I drain TEA152X Product data sheet Quick reference data Parameter Conditions ...
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... TEA1523P DIP8 plastic dual in-line package; 8 leads (300 mil) TEA1520T SO14 plastic small outline package; 14 leads; body width 3.9 mm TEA1521T SO14 plastic small outline package; 14 leads; body width 3.9 mm TEA1522T SO14 plastic small outline package; 14 leads; body width 3 Block diagram ...
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... NXP Semiconductors 7. Pinning information 7.1 Pinning Fig 2. 7.2 Pin description Table 3. Symbol V CC GND RC REG AUX SOURCE n.c. DRAIN 8. Functional description The TEA152x family is the heart of a compact flyback converter, with the IC placed at the primary side. The auxiliary winding of the transformer can be used for indirect feedback to control the isolated output ...
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... NXP Semiconductors components R Furthermore, a primary stroke is started only in a valley of the secondary ringing. This valley switching principle minimizes capacitive switch-on losses. 8.1 Start-up and Underoltage lockout Initially, the IC is self supplying from the rectified mains voltage. The IC starts switching as soon as the voltage on pin V the auxiliary winding of the transformer as soon as V from the line is stopped for high efficiency operation ...
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... NXP Semiconductors As soon as the oscillator voltage is high again and the secondary stroke has ended, the circuit waits for a low drain voltage before starting a new primary stroke. Figure 4 secondary stroke and the RC voltage. The primary stroke starts some time before the actual valley at low ringing frequencies, and some time after the actual valley at high ringing frequencies ...
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... NXP Semiconductors Fig 5. 8.5 Demagnetization The system operates in discontinuous conduction mode all the time. As long as the secondary stroke has not ended, the oscillator will not start a new primary stroke. During the first t be necessary in applications where the transformer has a large leakage inductance and at low output voltages ...
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... NXP Semiconductors 8.10 OverVoltage Protection (OVP) Overvoltage protection can be achieved in the application by pulling pin REG above its normal operation level. The current primary stroke is terminated immediately, and no new primary stroke is started until the voltage on pin REG drops to its normal operation level. ...
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... NXP Semiconductors 9. Limiting values Table 4. In accordance with the Absolute Maximum Rating System (IEC 60134). All voltages are measured with respect to ground; positive currents flow into the device; pins V current driven and pins REG and AUX are not allowed to be voltage driven. ...
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... NXP Semiconductors 10. Thermal characteristics Table 5. Symbol R th(j-a) [1] Thermal resistance R printed-circuit board. See the TEA152x application note for details. 11. Characteristics Table amb positive when flowing into the IC; unless otherwise specified. Symbol Supply I CC(oper) I CC(startup) I CC(ch) V CC(startup) V CC(stop) I drain Pulse-width modulator δ min δ ...
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... NXP Semiconductors Table amb positive when flowing into the IC; unless otherwise specified. Symbol Valley switching (ΔV/Δt) vrec f valley t d(vrec-swon) Current and short-circuit winding protection V source(max) t d(prop) V swp t leb FET output stage I L(drain) V BR(DRAIN) R DSon t f(DRAIN) Temperature protection T prot(max) T prot(hys) TEA152X ...
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... NXP Semiconductors 12. Application information mains R1 Fig 6. Primary sensed application; configuration for TEA152xP (DIP8) Further application information can be found in the TEA152x application note. TEA152X Product data sheet LF CF1 CF2 VCC V DRAIN GND n. TEA152xP RC SOURCE REG AUX All information provided in this document is subject to legal disclaimers. ...
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... NXP Semiconductors 13. Package outline DIP8: plastic dual in-line package; 8 leads (300 mil pin 1 index 1 DIMENSIONS (inch dimensions are derived from the original mm dimensions UNIT max. min. max. mm 4.2 0.51 3.2 inches 0.17 0.02 0.13 Note 1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. ...
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... NXP Semiconductors SO14: plastic small outline package; 14 leads; body width 3 pin 1 index 1 e DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT max. 0.25 1.45 mm 1.75 0.25 0.10 1.25 0.010 0.057 inches 0.069 0.01 0.004 0.049 Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. ...
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... Table 4 TEA152X_3 20090323 • Modifications: The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • Legal texts have been adapted to the new company name where appropriate. • The minimum value of T • The minimum value of T ...
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... In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or ...
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... Product data sheet NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ ...
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... NXP Semiconductors 18. Tables Table 1. Quick reference data . . . . . . . . . . . . . . . . . . . . .2 Table 2. Ordering information . . . . . . . . . . . . . . . . . . . . .3 Table 3. Pin description . . . . . . . . . . . . . . . . . . . . . . . . . .4 Table 4. Limiting values . . . . . . . . . . . . . . . . . . . . . . . . . .9 Table 5. Thermal characteristics . . . . . . . . . . . . . . . . . .10 Table 6. Characteristics . . . . . . . . . . . . . . . . . . . . . . . . .10 Table 7. Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . .15 Table 8. Revision history . . . . . . . . . . . . . . . . . . . . . . . .15 TEA152X Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 04 — 14 September 2010 ...
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... NXP Semiconductors 19. Figures Fig 1. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . .3 Fig 2. Pin configuration DIP8 . . . . . . . . . . . . . . . . . . . . . .4 Fig 3. Pin configuration SO14 . . . . . . . . . . . . . . . . . . . . .4 Fig 4. Signals for valley switching . . . . . . . . . . . . . . . . . .6 Fig 5. Typical phase of drain ringing at switch-on (at N × V Fig 6. Primary sensed application; configuration for TEA152xP (DIP8 .12 Fig 7. Package outline SOT97-1 (DIP8 .13 Fig 8. ...
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... NXP Semiconductors 20. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 4 Quick reference data . . . . . . . . . . . . . . . . . . . . . 2 5 Ordering information . . . . . . . . . . . . . . . . . . . . . 3 6 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3 7 Pinning information . . . . . . . . . . . . . . . . . . . . . . 4 7.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 7.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 8 Functional description . . . . . . . . . . . . . . . . . . . 4 8.1 Start-up and Underoltage lockout . . . . . . . . . . . 5 8.2 Oscillator 8.3 Duty factor control . . . . . . . . . . . . . . . . . . . . . . 5 8 ...