PCF8574T NXP Semiconductors, PCF8574T Datasheet - Page 18
PCF8574T
Manufacturer Part Number
PCF8574T
Description
Manufacturer
NXP Semiconductors
Datasheet
1.PCF8574T.pdf
(24 pages)
Specifications of PCF8574T
Operating Temperature (min)
-40C
Operating Temperature Classification
Industrial
Operating Temperature (max)
85C
Package Type
SO
Rad Hardened
No
Lead Free Status / Rohs Status
Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PCF8574T
Manufacturer:
PHILIPS
Quantity:
72
Company:
Part Number:
PCF8574T
Manufacturer:
NXPLIPS
Quantity:
5 510
Company:
Part Number:
PCF8574T
Manufacturer:
PHILIPS
Quantity:
9
Part Number:
PCF8574T
Manufacturer:
NXP/恩智浦
Quantity:
20 000
Company:
Part Number:
PCF8574T-3
Manufacturer:
PHILIPS
Quantity:
716
Part Number:
PCF8574T-3
Manufacturer:
PHILIPS/飞利浦
Quantity:
20 000
Company:
Part Number:
PCF8574T/3
Manufacturer:
NXP
Quantity:
1 233
Part Number:
PCF8574T/3
Manufacturer:
NXP
Quantity:
20 000
Part Number:
PCF8574T/3,518
Manufacturer:
NXP/恩智浦
Quantity:
20 000
Part Number:
PCF8574T/3518
Manufacturer:
NXP/恩智浦
Quantity:
20 000
Philips Semiconductors
2002 Nov 22
SO16: plastic small outline package; 16 leads; body width 7.5 mm
Remote 8-bit I/O expander for I
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
inches
UNIT
mm
VERSION
OUTLINE
SOT162-1
max.
2.65
0.10
A
16
0.012
0.004
0.30
0.10
1
A
Z
1
y
pin 1 index
0.096
0.089
2.45
2.25
A
2
075E03
IEC
e
0.01
0.25
A
3
D
0.019
0.014
0.49
0.36
b
p
0.013
0.009
0.32
0.23
MS-013
JEDEC
b
c
p
0
REFERENCES
0.41
0.40
10.5
10.1
D
9
8
(1)
w
2
M
C-bus
0.30
0.29
E
7.6
7.4
(1)
scale
0.050
EIAJ
1.27
18
c
5
e
0.419
0.394
10.65
10.00
A
H
2
E
A
1
0.055
1.4
L
10 mm
0.043
0.016
1.1
0.4
L
H
E
p
E
detail X
0.043
0.039
1.1
1.0
Q
L
L
p
Q
PROJECTION
EUROPEAN
0.25
0.01
(A )
v
3
A
0.25
0.01
w
A
Product specification
X
0.004
v
0.1
y
M
PCF8574
ISSUE DATE
A
99-12-27
97-05-22
0.035
0.016
Z
0.9
0.4
(1)
SOT162-1
8
0
o
o