TE28F800B3B110 Intel, TE28F800B3B110 Datasheet - Page 26

• Manufacturer Part Number: TE28F800B3B110
• Manufacturer: Intel

Specifications of TE28F800B3B110

• Lead Free Status / Rohs Status: Not Compliant

28F008/800B3, 28F016/160B3, 28F320B3, 28F640B3
4.3
Figure 4.
18 Aug 2005
26
Dimensions Table
Note: (1) Package dimensions are for reference only. These dimensions are estimates based
on die size, and are subject to change.
Package Height
Ball Height
Package Body Thickness
Ball (Lead) Width
Package Body Width
Package Body Length
Pitch
Ball (Lead) Count
Seating Plane Coplanarity
Corner to Ball A1 Distance Along D
Corner to Ball A1 Distance Along E
Ball A1
Corner
Easy BGA Package
Easy BGA Package Drawing
E
A2
B
C
D
E
F
G
H
A
1
Top View - Ball side down
A1
2
Intel
3
®
Order Number: 290580, Revision: 020
Side View
Advanced Boot Block Flash Memory (B3)
4
D
5
6
Symbol
A
A
7
[e]
S
S
A
D
N
b
E
Y
1
2
1
2
8
Millimeters
12.900
0.250
0.330
9.900
1.400
2.900
Min
A
A
B
C
D
G
H
E
F
10.000
13.000
0.780
0.430
1.000
1.500
3.000
Nom
8
64
Seating
Plane
Bottom View - Ball Side Up
7
10.100
13.100
1.200
0.530
0.100
1.600
3.100
6
Max
5
Notes
Note: Drawing not to scale
4
1
1
1
1
3
Inches
0.0098
0.0130
0.3898
0.5079
0.0551
0.1142
Min
2
1
Y
S1
0.0307
0.0169
0.3937
0.5118
0.0394
0.0591
0.1181
Nom
64
b
e
S2
Ball A1
Corner
Datasheet
0.0472
0.0209
0.3976
0.5157
0.0039
0.0630
0.1220
Max