CY7C1381C-117AC Cypress Semiconductor Corp, CY7C1381C-117AC Datasheet - Page 27

• Manufacturer Part Number: CY7C1381C-117AC
• Manufacturer: Cypress Semiconductor Corp

Specifications of CY7C1381C-117AC

• Density: 18Mb
• Access Time (max): 7.5ns
• Sync/async: Synchronous
• Architecture: SDR
• Clock Freq (max): 117MHz
• Operating Supply Voltage (typ): 3.3V
• Address Bus: 19b
• Package Type: TQFP
• Operating Temp Range: 0C to 70C
• Number Of Ports: 1
• Supply Current: 190mA
• Operating Supply Voltage (min): 3.135V
• Operating Supply Voltage (max): 3.6V
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Pin Count: 100
• Word Size: 36b
• Number Of Words: 512K
• Lead Free Status / Rohs Status: Not Compliant

Document #: 38-05238 Rev. *B
AC Test Loads and Waveforms
Capacitance
Thermal Resistance
C
C
C
Notes:
14. Tested initially and after any design or process change that may affect these parameters
IN
CLK
I/O
OUTPUT
OUTPUT
Parameter
Parameter
3.3V I/O Test Load
2.5V I/O Test Load
Θ
Θ
JC
JA
[14]
Z
Z
0
0
Thermal Resistance
(Junction to Ambient)
Thermal Resistance
(Junction to Case)
= 50Ω
= 50Ω
Input Capacitance
Clock Input Capacitance
Input/Output Capacitance
Description
(a)
(a)
V
V
L
[14]
Description
L
= 1.25V
= 1.5V
R
R
L
L
= 50Ω
= 50Ω
OUTPUT
OUTPUT
3.3V
2.5V
Test conditions follow standard
test methods and procedures
for measuring thermal
impedence, per EIA / JESD51.
INCLUDING
INCLUDING
T
V
V
JIG AND
JIG AND
SCOPE
SCOPE
A
DD
DDQ
Test Conditions
5 pF
5 pF
= 25°C, f = 1 MHz,
= 3.3V.
Test Conditions
= 2.5V
(b)
(b)
R = 317Ω
R = 1667Ω
R = 351Ω
R =1538Ω
V
Package
Package
GND
GND
DD
TQFP
V
TQFP
DD
31
6
≤ 1ns
≤ 1ns
5
5
5
10%
10%
Package
Package
ALL INPUT PULSES
ALL INPUT PULSES
BGA
BGA
45
8
8
8
7
90%
90%
(c)
(c)
Package
Package
fBGA
CY7C1381C
CY7C1383C
fBGA
9
9
9
46
3
Page 27 of 36
90%
90%
10%
10%
°C/W
°C/W
≤ 1ns
≤ 1ns
Unit
Unit
pF
pF
pF
[+] Feedback