PCF8577CP NXP Semiconductors, PCF8577CP Datasheet - Page 19
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PCF8577CP
Manufacturer Part Number
PCF8577CP
Description
Manufacturer
NXP Semiconductors
Datasheet
1.PCF8577CP.pdf
(28 pages)
Specifications of PCF8577CP
Operating Supply Voltage (typ)
3.3/5V
Number Of Segments
64
Operating Temperature (min)
-40C
Operating Temperature (max)
85C
Operating Temperature Classification
Industrial
Package Type
PDIP
Pin Count
40
Mounting
Through Hole
Power Dissipation
500mW
Frequency (max)
100KHz
Operating Supply Voltage (min)
2.5V
Operating Supply Voltage (max)
6V
Lead Free Status / Rohs Status
Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PCF8577CP
Manufacturer:
ALTERA
Quantity:
370
Part Number:
PCF8577CP
Manufacturer:
PHILIPS/飞利浦
Quantity:
20 000
Part Number:
PCF8577CP/F3
Manufacturer:
NXP/恩智浦
Quantity:
20 000
Philips Semiconductors
13 CHIP DIMENSIONS AND BONDING PAD LOCATIONS
1998 Jul 30
handbook, full pagewidth
LCD direct/duplex driver with
I
Chip area = 4.62 mm
Thickness = 381 25 m.
n-substrate (back) connected to V
Bonding pad dimensions = 110 m
2
C-bus interface
2
.
DD
2.31
.
mm
110 m.
handbook, halfpage
S27
S26
S25
S24
S23
S22
S21
S20
S19
S18
10
12
13
14
15
16
11
5
6
7
8
9
Fig.18 Bonding pad locations.
17
Fig.19 Reference marks.
4
18
3
x
19
2
PCF8577C
0
20
2 mm
1
y
0
19
40
21
39
22
38
23
MBE924
37
24
MGA726
36
35
34
33
32
31
30
29
28
27
26
25
V DD
A2/BP2
BP1
S1
S2
S3
S4
S5
S6
S7
Product specification
PCF8577C