ELANSC400-66AI AMD (ADVANCED MICRO DEVICES), ELANSC400-66AI Datasheet - Page 131

ELANSC400-66AI

Manufacturer Part Number
ELANSC400-66AI
Description
Manufacturer
AMD (ADVANCED MICRO DEVICES)
Datasheet

Specifications of ELANSC400-66AI

Cpu Family
Elan
Device Core Size
16/32Bit
Frequency (max)
66MHz
Interface Type
ISA
Program Memory Type
ROMLess
Program Memory Size
Not Required
Number Of Timers - General Purpose
1
Operating Supply Voltage (typ)
3.3V
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
3V
Instruction Set Architecture
CISC
Operating Temp Range
-40C to 95C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
292
Package Type
BGA
Lead Free Status / Rohs Status
Not Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
ELANSC400-66AI
Manufacturer:
AMD
Quantity:
12 388
PHYSICAL DIMENSIONS—BGA 292—PLASTIC BALL GRID ARRAY
ALIGNMENT MARK
0.75 SQ
ENCAPSULATION
(DATUM B)
A1 CORNER I.D.
A1 CORNER
C
3X
THERMAL BALLS
4X
.30
.10
0.635
0.60
0.90
.20
BSC
Élan™SC400 and ÉlanSC410 Microcontrollers Data Sheet
2.11
2.61
S
S
0.50
0.70
C A B
C
SCALE:NONE
0.51
0.61
DETAIL A
20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1
0.635
BSC
BOTTOM VIEW
SIDE VIEW
27.00 BSC
17.00 MIN
(DIE SIDE)
24.13 BSC
TOP SIDE
21.20
22.80
0.15 C
(DATUM A)
ALL ROWS AND COLUMNS
SEATING PLANE
A
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
1.27 BSC
A
4.445
0.50 R.
A1 CORNER I.D.
27.00
3X
BSC
3X
A1 CORNER
B
0.15 C
24.13
0.15 C
BSC
16-038-BGA292-2_AB
ES114
9.14.98 lv
131

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