TEA1095T NXP Semiconductors, TEA1095T Datasheet

TEA1095T

Manufacturer Part Number
TEA1095T
Description
Manufacturer
NXP Semiconductors
Datasheet

Specifications of TEA1095T

Operating Temp Range
-25C to 75C
Package Type
SO
Pin Count
24
Operating Temperature Classification
Commercial
Mounting
Surface Mount
Lead Free Status / Rohs Status
Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
TEA1095T
Manufacturer:
NXP/恩智浦
Quantity:
20 000
Part Number:
TEA1095T/C2
Manufacturer:
NXPLIPS
Quantity:
5 510
Part Number:
TEA1095TS
Manufacturer:
PHI
Quantity:
1 000
Part Number:
TEA1095TS
Manufacturer:
PHILIPS/飞利浦
Quantity:
20 000
Product specification
Supersedes data of 1996 Mar 22
File under Integrated Circuits, IC03
DATA SHEET
TEA1095
Voice switched speakerphone IC
INTEGRATED CIRCUITS
1997 Nov 25

Related parts for TEA1095T

TEA1095T Summary of contents

Page 1

DATA SHEET TEA1095 Voice switched speakerphone IC Product specification Supersedes data of 1996 Mar 22 File under Integrated Circuits, IC03 INTEGRATED CIRCUITS 1997 Nov 25 ...

Page 2

... NAME TEA1095 DIP24 plastic dual in-line package; 24 leads (600 mil) TEA1095T SO24 plastic small outline package; 24 leads; body width 7.5 mm TEA1095TS SSOP24 plastic shrink small outline package; 24 leads; body width 5.3 mm 1997 Nov 25 APPLICATIONS Mains, battery or line-powered telephone sets Cordless telephones ...

Page 3

Philips Semiconductors Voice switched speakerphone IC QUICK REFERENCE DATA kHz GND in test circuit of Fig.11; unless otherwise specified. SYMBOL PARAMETER V supply voltage BB I current ...

Page 4

Philips Semiconductors Voice switched speakerphone IC BLOCK DIAGRAM handbook, full pagewidth MUTETX TXIN 18 TXIN R MIC R TSEN 24 TSEN C TSEN C TENV 23 TENV C TNOI 22 TNOI ...

Page 5

Philips Semiconductors Voice switched speakerphone IC PINNING SYMBOL PIN DESCRIPTION MUTERX 1 receiver channel mute input RXIN 2 receiver amplifier input n.c. 3 not connected GARX 4 receiver gain adjustment RXOUT 5 receiver amplifier output GND 6 ground reference V ...

Page 6

Philips Semiconductors Voice switched speakerphone IC FUNCTIONAL DESCRIPTION The values given in the functional description are typical values except when otherwise specified. A principle diagram of the TEA1096 is shown on the left side of Fig.3. The TEA1096 is a ...

Page 7

Philips Semiconductors Voice switched speakerphone IC Supply: pins V , GND and PD BB The TEA1095 must be supplied with an external stabilized voltage source between pins V BB without any signal, the internal supply current is 2 ...

Page 8

Philips Semiconductors Voice switched speakerphone IC Receive channel handbook, full pagewidth R GARX C GARX to loudspeaker amplifier R : RXIN, GARX, RXOUT ECEIVER AMPLIFIER PINS MUTERX The TEA1095 has an asymmetrical input (RXIN) for the receiver amplifier with an ...

Page 9

Philips Semiconductors Voice switched speakerphone IC The capacitors connected in series with the two resistors block any DC component and form a first order high-pass filter. In the basic application (see Fig.12 assumed that ...

Page 10

Philips Semiconductors Voice switched speakerphone IC handbook, full pagewidth INPUT SIGNAL SIGNAL ENVELOPE A: 85 dB/ms B: 0.7 dB/ms NOISE ENVELOPE B: 0.7 dB/ms C: 0.07 dB/ms handbook, full pagewidth TENV TNOI ATTEN- UATOR RENV RNOI MUTETX (1) When MUTETX ...

Page 11

Philips Semiconductors Voice switched speakerphone IDT SWT ECISION LOGIC PINS AND The TEA1095 selects its mode of operation (transmit, receive or idle mode) by comparing the signal and the noise envelopes of both channels. This is executed ...

Page 12

Philips Semiconductors Voice switched speakerphone IC handbook, full pagewidth Where C = constant. handbook, halfpage G vtx, G vrx (10 dB/div) 1997 Nov 25 DUPLEX CONTROLLER to transmit from amplifier SWT STAB G vtx G vrx C SWR VOICE SWITCH ...

Page 13

... V BB(max storage temperature stg T operating ambient temperature amb THERMAL CHARACTERISTICS SYMBOL R thermal resistance from junction to ambient in free air th j-a TEA1095 TEA1095T TEA1095TS CHARACTERISTICS kHz GND in test circuit of Fig.11; unless otherwise specified. SYMBOL PARAMETER Supply ( and GND supply voltage ...

Page 14

Philips Semiconductors Voice switched speakerphone IC SYMBOL PARAMETER G voltage gain variation with vtxf frequency referenced to 1 kHz V noise output voltage at notx pin TXOUT T MUTETX RANSMIT MUTE INPUT V LOW level input voltage IL V HIGH ...

Page 15

Philips Semiconductors Voice switched speakerphone IC SYMBOL PARAMETER G gain reduction with MUTERX vrxm active Envelope and noise detectors (TSEN, TENV, TNOI, RSEN, RENV and RNOI) P REAMPLIFIERS G voltage gain from TXIN to TSEN v(TSEN) G voltage gain between ...

Page 16

Philips Semiconductors Voice switched speakerphone IC SYMBOL PARAMETER Decision logic (IDT and SWT) S IGNAL RECOGNITION V threshold voltage between Srx(th) pins RENV and RNOI to switch-over from receive to idle mode V threshold voltage between Stx(th) pins TENV and ...

Page 17

Philips Semiconductors Voice switched speakerphone IC TEST AND APPLICATION INFORMATION 1997 Nov 25 17 Product specification TEA1095 pagewidth full handbook, ...

Page 18

Philips Semiconductors Voice switched speakerphone IC 1997 Nov 25 18 Product specification TEA1095 pagewidth full handbook, ...

Page 19

R DD 390 S4 S3 MUTET S1 S2 tip DP MICRO- DTMF DTMF CONTROLLER ring C VDD 100 F interrupter SWITCH MODE S1 S2 Hands-free OPEN OPEN Handset CLOSED CLOSED Handset plus listening-in OPEN CLOSED 470 F R SLPE C ...

Page 20

Philips Semiconductors Voice switched speakerphone IC PACKAGE OUTLINES DIP24: plastic dual in-line package; 24 leads (600 mil pin 1 index 1 DIMENSIONS (inch dimensions are derived from the original mm dimensions UNIT ...

Page 21

Philips Semiconductors Voice switched speakerphone IC SO24: plastic small outline package; 24 leads; body width 7 pin 1 index 1 e DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT ...

Page 22

Philips Semiconductors Voice switched speakerphone IC SSOP24: plastic shrink small outline package; 24 leads; body width 5 pin 1 index 1 e DIMENSIONS (mm are the original dimensions) A UNIT ...

Page 23

Philips Semiconductors Voice switched speakerphone IC SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering ...

Page 24

Philips Semiconductors Voice switched speakerphone IC DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This ...

Page 25

Philips Semiconductors Voice switched speakerphone IC 1997 Nov 25 NOTES 25 Product specification TEA1095 ...

Page 26

Philips Semiconductors Voice switched speakerphone IC 1997 Nov 25 NOTES 26 Product specification TEA1095 ...

Page 27

Philips Semiconductors Voice switched speakerphone IC 1997 Nov 25 NOTES 27 Product specification TEA1095 ...

Page 28

Philips Semiconductors – a worldwide company Argentina: see South America Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113, Tel. +61 2 9805 4455, Fax. +61 2 9805 4466 Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213, Tel. +43 160 1010, ...

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