CY8C9520-24PVXI Cypress Semiconductor Corp, CY8C9520-24PVXI Datasheet - Page 23

• Manufacturer Part Number: CY8C9520-24PVXI
• Manufacturer: Cypress Semiconductor Corp

Specifications of CY8C9520-24PVXI

• Operating Temperature (min): -40C
• Operating Temperature Classification: Industrial
• Operating Temperature (max): 85C
• Package Type: SSOP
• Rad Hardened: No
• Lead Free Status / Rohs Status: Compliant

CY8C95xx Preliminary Data Sheet
5.2
Table 5-1. Thermal Impedances per Package
5.3
Following is the minimum solder reflow peak temperature to achieve good solderability.
Table 5-2. Solder Reflow Peak Temperature
August 17, 2005
* T
*Higher temperatures may be required based on the solder melting point. Typical temperatures for solder are 220+/-5
with Sn-Pb or 245+/-5
J
= T
A
+ POWER x
Thermal Impedances
100 TQFP
Solder Reflow Peak Temperature
100 TQFP
Package
28 SSOP
48 SSOP
Package
28 SSOP
48 SSOP
o
θ
C with Sn-Ag-Cu paste. Refer to the solder manufacturer specifications.
JA
Minimum Peak Temperature*
Typical
101
69
48
240
220
220
o
o
Document No. 38-12036 Rev. *A
o
C/W
C/W
C/W
o
o
o
C
C
C
θ
JA
*
Maximum Peak Temperature
260
260
260
o
o
o
C
C
C
o
C
5. Packaging Information
23
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