TEA1654T NXP Semiconductors, TEA1654T Datasheet - Page 17

• Manufacturer Part Number: TEA1654T
• Manufacturer: NXP Semiconductors

Specifications of TEA1654T

• Operating Temperature (max): 145C
• Operating Temperature (min): -20C
• Pin Count: 14
• Mounting: Surface Mount
• Package Type: SO
• Screening Level: Commercial
• Lead Free Status / Rohs Status: Compliant

Philips Semiconductors
PACKAGE OUTLINE
2003 May 12
SO14: plastic small outline package; 14 leads; body width 3.9 mm
GreenChip II SMPS control IC
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Note
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
inches
UNIT
mm
VERSION
OUTLINE
SOT108-1
0.069
max.
1.75
A
0.010
0.004
0.25
0.10
A
14
1
1
Z
pin 1 index
y
0.057
0.049
1.45
1.25
A
2
076E06
IEC
0.01
0.25
e
A
3
0.019
0.014
0.49
0.36
b
p
D
0.0100
0.0075
0.25
0.19
MS-012
JEDEC
c
REFERENCES
0.35
0.34
8.75
8.55
D
(1)
0
0.16
0.15
E
4.0
3.8
b
(1)
p
8
7
JEITA
scale
1.27
0.05
2.5
17
e
w
M
c
0.244
0.228
H
6.2
5.8
E
A
2
0.041
5 mm
1.05
A
L
1
0.039
0.016
1.0
0.4
L
p
H
E
E
0.028
0.024
detail X
0.7
0.6
Q
PROJECTION
L
L
EUROPEAN
0.25
0.01
p
Q
v
(A )
3
A
0.25
0.01
w
Product specification
0.004
A
0.1
X
v
y
TEA1654
M
ISSUE DATE
99-12-27
03-02-19
A
0.028
0.012
Z
0.7
0.3
(1)
SOT108-1
8
0
o
o