TDA1575T NXP Semiconductors, TDA1575T Datasheet - Page 12
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TDA1575T
Manufacturer Part Number
TDA1575T
Description
Manufacturer
NXP Semiconductors
Datasheet
1.TDA1575T.pdf
(16 pages)
Specifications of TDA1575T
Operating Temperature (min)
-40C
Operating Temperature (max)
85C
Operating Temperature Classification
Industrial
Product Depth (mm)
4mm
Lead Free Status / Rohs Status
Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
TDA1575T
Manufacturer:
PHILIPS/飞利浦
Quantity:
20 000
Part Number:
TDA1575T/V2/N
Manufacturer:
PHILIPS/飞利浦
Quantity:
20 000
Philips Semiconductors
PACKAGE OUTLINE
April 1993
SO16: plastic small outline package; 16 leads; body width 3.9 mm
FM front end circuit for
CENELEC EN 55020 applications
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
inches
UNIT
mm
VERSION
OUTLINE
SOT109-1
0.069
max.
1.75
A
16
1
0.010
0.004
Z
0.25
0.10
pin 1 index
A
1
y
0.057
0.049
1.45
1.25
A
076E07S
2
IEC
0.25
0.01
A
3
e
0.019
0.014
0.49
0.36
b
p
D
MS-012AC
0.0100
0.0075
0.25
0.19
JEDEC
c
REFERENCES
10.0
0.39
0.38
D
9.8
0
(1)
0.16
0.15
E
4.0
3.8
(1)
b
scale
p
0.050
EIAJ
2.5
1.27
12
9
8
e
w
0.244
0.228
H
6.2
5.8
c
M
E
5 mm
0.041
A
1.05
2
L
A
1
0.039
0.016
1.0
0.4
L
p
0.028
0.020
H
0.7
0.6
E
Q
E
detail X
PROJECTION
EUROPEAN
0.25
0.01
L
v
L
p
Q
0.25
0.01
(A )
Preliminary specification
w
3
A
0.004
TDA1575T
0.1
y
A
X
v
ISSUE DATE
95-01-23
97-05-22
M
0.028
0.012
Z
0.7
0.3
(1)
A
SOT109-1
8
0
o
o