BGD812 NXP Semiconductors, BGD812 Datasheet
BGD812
Specifications of BGD812
Available stocks
Related parts for BGD812
BGD812 Summary of contents
Page 1
... DATA SHEET book, halfpage BGD812 860 MHz, 18.5 dB gain power doubler amplifier Product specification Supersedes data of 2001 Sep 07 DISCRETE SEMICONDUCTORS M3D252 2001 Oct 30 ...
Page 2
... V RF input voltage i T storage temperature stg T operating mounting base temperature mb 2001 Oct 30 PINNING - SOT115J PIN handbook, halfpage CONDITIONS MHz f = 870 MHz PARAMETER 2 Product specification BGD812 DESCRIPTION 1 input common common 9 output Side view MSA319 Fig.1 Simplified outline. MIN. MAX. 18.2 18.8 ...
Page 3
... dBmV 55.25 MHz o m 112 chs 745.25 MHz 50.2 dBmV at 745 MHz; note chs 331.25 MHz 47.3 dBmV at 547 MHz; note Product specification BGD812 MIN. TYP. MAX. UNIT 18.2 18.8 dB 0.4 0.9 1.4 dB 0.25 dB ...
Page 4
... MHz 6 dB 858.25 MHz Product specification BGD812 MAX. UNIT 67 dB 60 dB 58 dB 57 dB 64 dB 71 dB dBmV dBmV dBmV 5.5 dB 5.5 dB 6.5 dB 7.5 dB 410 mA = 860.25 MHz ...
Page 5
... Typ. +3 . (2) Fig.3 MLD353 52 ( (dBmV) 48 (2) 44 (3) 40 (4) 36 800 1000 f (MHz) 5 Product specification BGD812 (1) 200 400 600 800 f (MHz chs; tilt = 7.3 dB (50 to 550 MHz). B (3) Typ. (4) Typ. 3 . Cross modulation as a function of frequency under tilted conditions. MLD352 (dBmV (2) (3) ...
Page 6
... 112 chs; tilt = 10.3 dB (50 to 750 MHz ( (3) Typ. o Typ. +3 . (4) Typ. 3 . (2) Fig.6 Cross modulation as a function of frequency under tilted conditions. Product specification BGD812 MLD355 52 ( (dBmV) 48 (2) 44 (3) ( 800 1000 f (MHz) ...
Page 7
... REFERENCES JEDEC JEITA 8.2 6-32 44.25 7.8 UNC EUROPEAN PROJECTION Product specification BGD812 SOT115J max. 0.25 0.7 0.1 3.8 ISSUE DATE 04-02-04 10-06-18 ...
Page 8
... NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. 8 Product specification BGD812 DEFINITION ...
Page 9
... NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. 9 Product specification BGD812 ...
Page 10
... Interface, Security and Digital Processing expertise Customer notification This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal definitions and disclaimers. No changes were made to the technical content, except for package outline drawings which were updated to the latest version. ...