SAA6581TD NXP Semiconductors, SAA6581TD Datasheet - Page 10

• Manufacturer Part Number: SAA6581TD
• Manufacturer: NXP Semiconductors

Specifications of SAA6581TD

• Pin Count: 16
• Screening Level: Industrial
• Package Type: SO
• Lead Free Status / Rohs Status: Compliant

Philips Semiconductors
PACKAGE OUTLINES
2003 Oct 10
SO16: plastic small outline package; 16 leads; body width 7.5 mm
RDS/RBDS demodulator
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Note
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
inches
UNIT
mm
OUTLINE
VERSION
SOT162-1
max.
2.65
0.1
A
16
0.012
0.004
1
A
0.3
0.1
Z
1
y
pin 1 index
0.096
0.089
2.45
2.25
A
2
075E03
IEC
e
0.25
0.01
A
3
D
0.019
0.014
0.49
0.36
b
p
0.013
0.009
0.32
0.23
MS-013
JEDEC
b
c
p
0
REFERENCES
10.5
10.1
0.41
0.40
D
9
8
(1)
w
M
0.30
0.29
E
7.6
7.4
(1)
JEITA
scale
1.27
0.05
c
10
5
e
0.419
0.394
10.65
10.00
A
H
2
E
A
1
0.055
1.4
L
10 mm
0.043
0.016
1.1
0.4
L
H
E
p
E
detail X
0.043
0.039
1.1
1.0
Q
L
L
p
Q
PROJECTION
EUROPEAN
0.25
0.01
(A )
v
3
A
0.01
0.25
w
A
Product specification
X
0.004
v
0.1
y
M
SAA6581
ISSUE DATE
A
99-12-27
03-02-19
0.035
0.016
Z
0.9
0.4
(1)
SOT162-1
8
0
o
o