TDA7540B STMicroelectronics, TDA7540B Datasheet - Page 77

• Manufacturer Part Number: TDA7540B
• Manufacturer: STMicroelectronics

Specifications of TDA7540B

• Case: TQFP
• Dc: 06+
• Lead Free Status / Rohs Status: Compliant

DOCUMENT CD00108485
Copyright STMicroelectronics
TDA7540B
10
REVISION 1.0
Package Information
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a Lead-free second level interconnect. The category of
second Level Interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97.
The maximum ratings related to soldering conditions are also marked on the inner box label.
ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.
Figure 19. TQFP80 (14x14x1.40mm) Mechanical Data & Package Dimensions
DIM.
A1
A2
D1
D3
E1
E3
L1
A
B
C
D
E
K
e
L
B
e
MIN.
0.05
1.35
0.22
0.09
0.45
61
80
60
1
IDENTIFICATION
16.00
14.00
12.35
16.00
14.00
12.35
TYP.
1.40
0.32
0.65
0.60
1.00
mm
PIN 1
3.5°(min.), 7°(max.)
MAX.
1.60
0.15
1.45
0.38
0.20
0.75
0.002
0.053
0.009
0.003
0.018
MIN.
D1
D3
D
COMPANY INTERNAL
0.0256
0.0393
0.013
0.630
0.630
0.024
0.055
0.551
0.295
0.551
0.486
TYP.
inch
ACTIVE
MAX.
0.063
0.006
0.057
0.015
0.008
0.030
41
20
40
21
TQFP80L
E3
E1
MECHANICAL DATA
(14x14x1.40mm)
E
OUTLINE AND
K
TQFP80
Gage plane
0.25mm
L
Unauthorized reproduction and communication strictly prohibited
L1
Seating Plane
0.10mm
DATE 11-May-2006
.004
Package Information
C
A1
A2
A
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