M25P16-VMN6P Micron Technology Inc, M25P16-VMN6P Datasheet

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M25P16-VMN6P

Manufacturer Part Number
M25P16-VMN6P
Description
Manufacturer
Micron Technology Inc
Datasheet

Specifications of M25P16-VMN6P

Cell Type
NOR
Density
16Mb
Access Time (max)
8ns
Interface Type
Serial (SPI)
Boot Type
Not Required
Address Bus
1b
Operating Supply Voltage (typ)
3.3V
Operating Temp Range
-40C to 85C
Package Type
SOIC N
Program/erase Volt (typ)
2.7 to 3.6V
Sync/async
Synchronous
Operating Temperature Classification
Industrial
Operating Supply Voltage (min)
2.7V
Operating Supply Voltage (max)
3.6V
Word Size
8b
Number Of Words
2M
Supply Current
12mA
Mounting
Surface Mount
Pin Count
8
Lead Free Status / Rohs Status
Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
M25P16-VMN6P
Manufacturer:
Numonyx/ST Micro
Quantity:
83 042
Part Number:
M25P16-VMN6P
Manufacturer:
ST
0
Part Number:
M25P16-VMN6P
Manufacturer:
MICRON
Quantity:
20 000
Part Number:
M25P16-VMN6PBA
Manufacturer:
ST
0
Part Number:
M25P16-VMN6PBA
Manufacturer:
ST
Quantity:
20 000
Features
n
n
n
n
n
n
n
n
n
n
n
n
n
December 2008
16 Mbit of Flash memory
Page Program (up to 256 bytes) in 0.64 ms
(typical)
Sector Erase (512 Kbit) in 0.6 s (typical)
Bulk Erase (16 Mbit) in 13 s (typical)
2.7 V to 3.6 V single supply voltage
SPI bus compatible serial interface
75 MHz Clock rate (maximum)
Deep Power-down mode 1 μA (typical)
Electronic signatures
– JEDEC standard two-byte signature
– Unique ID code (UID) with 16 bytes read-
– RES instruction, one-byte, signature (14h),
More than 100,000 Erase/Program cycles per
sector
Hardware Write Protection: protected area size
defined by three non-volatile bits (BP0, BP1
and BP2)
More than 20 year data retention
Packages
– RoHS compliant
(2015h)
only, available upon customer request
for backward compatibility
16 Mbit, serial Flash memory, 75 MHz SPI bus interface
Rev 15
300 mils width
6 × 5 mm (MLP8)
150 mils width
VFQFPN8 (MP)
PDIP8 (BA)
SO8N (MN)
8 x 6 mm (MLP8)
208 mils width
VDFPN8 (ME)
SO8W (MW)
300 mils width
SO16 (MF)
M25P16
www.numonyx.com
1/56
2

Related parts for M25P16-VMN6P

M25P16-VMN6P Summary of contents

Page 1

... BP1 and BP2) More than 20 year data retention n Packages n – RoHS compliant December 2008 VFQFPN8 (MP) 6 × (MLP8) SO8N (MN) 150 mils width PDIP8 (BA) 300 mils width Rev 15 M25P16 VDFPN8 (ME (MLP8) SO8W (MW) 208 mils width SO16 (MF) 300 mils width 1/56 www.numonyx.com 2 ...

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December 2008 Rev 15 2/56 2 ...

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Contents 1 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...

Page 4

SRWD bit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...

Page 5

List of tables Table 1. Signal names . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...

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List of figures Figure 1. Logic diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...

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... Description The M25P16 Mbit (2 Mbit × 8) serial Flash memory, with advanced write protection mechanisms, accessed by a high speed SPI-compatible bus. The memory can be programmed 1 to 256 bytes at a time, using the Page Program instruction. The memory is organized as 32 sectors, each containing 256 pages. Each page is 256 bytes wide ...

Page 8

... There is an exposed central pad on the underside of the VFQFPN package. This is pulled, internally and must not be allowed to be connected to any other voltage or signal line on the PCB See Package mechanical Figure 3. SO16 connections Don’t use 2. See Package mechanical 8/56 M25P16 HOLD AI08517 section for package dimensions, and how to identify pin-1. M25P16 HOLD ...

Page 9

Signal description 2.1 Serial Data output (Q) This output signal is used to transfer data serially out of the device. Data is shifted out on the falling edge of Serial Clock (C). 2.2 Serial Data input (D) This input ...

Page 10

V supply voltage the supply voltage. CC 2.8 V ground the reference for the V SS 10/56 supply voltage. CC ...

Page 11

... Serial Data output (Q) line at a time, the other devices are high impedance. Resistors R (represented in that the M25P16 is not selected if the Bus Master leaves the S line in the high impedance state. As the Bus Master may enter a state where all inputs/outputs are in high impedance at ...

Page 12

Example pF, that is R*C p Master never leaves the SPI bus in the high impedance state for a time period shorter than 5 μs. Figure 5. SPI modes supported CPOL CPHA ...

Page 13

Operating features 4.1 Page programming To program one data byte, two instructions are required: Write Enable (WREN), which is one byte, and a Page Program (PP) sequence, which consists of four bytes plus data. This is followed by the ...

Page 14

... Protection modes The environments where non-volatile memory devices are used can be very noisy. No SPI device can operate correctly in the presence of excessive noise. To help combat this, the M25P16 features the following data protection mechanisms: Power on reset and an internal timer (t l changes while the power supply is outside the operating specification ...

Page 15

Table 2. Protected area sizes Status Register content BP2 BP1 BP0 bit bit bit none Upper 32nd (Sector 31 Upper sixteenth (2 sectors: 30 and 31) Lower 15/16ths (30 sectors: 0 ...

Page 16

Figure 6. Hold condition activation C HOLD 16/56 Hold condition (standard use) (non-standard use) Hold condition AI02029D ...

Page 17

Memory organization The memory is organized as: 2 097 152 bytes (8 bits each sectors (512 Kbits, 65536 bytes each) l 8192 pages (256 bytes each). l Each page can be individually programmed (bits are programmed from ...

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Table 3. Memory organization Sector 18/56 Address range ...

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Instructions All instructions, addresses and data are shifted in and out of the device, most significant bit first. Serial Data input (D) is sampled on the first rising edge of Serial Clock (C) after Chip Select (S) is driven ...

Page 20

Table 4. Instruction set Instruction WREN Write Enable WRDI Write Disable RDID Read Identification RDSR Read Status Register WRSR Write Status Register READ Read Data Bytes Read Data Bytes at Higher FAST_READ Speed PP Page Program SE Sector Erase BE ...

Page 21

Write Disable (WRDI) The Write Disable (WRDI) instruction The Write Disable (WRDI) instruction is entered by driving Chip Select (S) Low, sending the instruction code, and then driving Chip Select (S) High. The Write Enable Latch (WEL) bit is ...

Page 22

Read Identification (RDID) The Read Identification (RDID) instruction allows to read the device identification data: Manufacturer identification (1 byte) l Device identification (2 bytes Unique ID code (UID) (17 bytes, of which 16 available upon customer request). ...

Page 23

Read Status Register (RDSR) The Read Status Register (RDSR) instruction allows the Status Register to be read. The Status Register may be read at any time, even while a Program, Erase or Write Status Register cycle is in progress. ...

Page 24

SRWD bit The Status Register Write Disable (SRWD) bit is operated in conjunction with the Write Protect (W) signal. The Status Register Write Disable (SRWD) bit and Write Protect (W) signal allow the device to be put in the ...

Page 25

Write Status Register (WRSR) The Write Status Register (WRSR) instruction allows new values to be written to the Status Register. Before it can be accepted, a Write Enable (WREN) instruction must previously have been executed. After the Write Enable ...

Page 26

Table 7. Protection modes W SRWD Mode signal bit 1 0 Software 0 0 Protected mode (SPM Hardwar 0 1 Protected mode (HPM defined by the values in the Block Protect (BP2, BP1, BP0) bits of ...

Page 27

Read Data Bytes (READ) The device is first selected by driving Chip Select (S) Low. The instruction code for the Read Data Bytes (READ) instruction is followed by a 3-byte address (A23-A0), each bit being latched-in during the rising ...

Page 28

Read Data Bytes at Higher Speed (FAST_READ) The device is first selected by driving Chip Select (S) Low. The instruction code for the Read Data Bytes at Higher Speed (FAST_READ) instruction is followed by a 3-byte address (A23- A0) ...

Page 29

Page Program (PP) The Page Program (PP) instruction allows bytes to be programmed in the memory (changing bits from 1 to 0). Before it can be accepted, a Write Enable (WREN) instruction must previously have been executed. After the ...

Page 30

Figure 15. Page Program (PP) instruction sequence Data byte MSB 1. Address bits A23 to A21 are Don’t care. 30/ ...

Page 31

Sector Erase (SE) The Sector Erase (SE) instruction sets to ‘1’ (FFh) all bits inside the chosen sector. Before it can be accepted, a Write Enable (WREN) instruction must previously have been executed. After the Write Enable (WREN) instruction ...

Page 32

Bulk Erase (BE) The Bulk Erase (BE) instruction sets all bits to ‘1’ (FFh). Before it can be accepted, a Write Enable (WREN) instruction must previously have been executed. After the Write Enable (WREN) instruction has been decoded, the ...

Page 33

Deep Power-down (DP) Executing the Deep Power-down (DP) instruction is the only way to put the device in the lowest consumption mode (the Deep Power-down mode). It can also be used as a software protection mechanism, while the device ...

Page 34

... Deep Power-down mode. The instruction can also be used to read, on Serial Data output (Q), the old-style 8-bit electronic signature, whose value for the M25P16 is 14h. Please note that this is not the same as, or even a subset of, the JEDEC 16-bit electronic signature that is read by the Read Identifier (RDID) instruction ...

Page 35

... C Instruction D High Impedance Q 1. The value of the 8-bit electronic signature, for the M25P16, is 14h. Figure 20. Release from Deep Power-down (RES) instruction sequence Instruction D High Impedance Q Driving Chip Select (S) High after the 8-bit instruction byte has been received by the device, but before the whole of the 8-bit electronic signature has been transmitted for the first time (as shown in still ensures that the device is put into Standby Power mode ...

Page 36

Power-up and power-down At power-up and power-down, the device must not be selected (that is Chip Select (S) must follow the voltage applied (min) at power-up, and then for a further delay ...

Page 37

Figure 21. Power-up timing (max (min) Reset state of the device V WI Table 8. Power-up timing and V Symbol ( (min Low VSL CC (1) t Time delay to ...

Page 38

Maximum rating Stressing the device above the rating listed in cause permanent damage to the device. These are stress ratings only and operation of the device at these or any other conditions above those indicated in the operating sections ...

Page 39

DC and AC parameters This section summarizes the operating and measurement conditions, and the DC and AC characteristics of the device. The parameters in the DC and AC characteristic tables that follow are derived from tests performed under the ...

Page 40

Table 14. DC characteristics Symbol I Input leakage current LI I Output leakage current LO I Standby current CC1 Deep Power-down I CC2 current I Operating current (READ) CC3 I Operating current (PP) CC4 I Operating current (WRSR) CC5 I ...

Page 41

Table 15. AC characteristics ( Applies only to products made with T9HX technology, identified with process digit ‘4’ Test conditions specified in Symbol Alt. Parameter Clock frequency for the following instructions FAST_READ, PP, SE, BE, DP, RES, WREN, ...

Page 42

Table 15. AC characteristics ( Applies only to products made with T9HX technology, identified with process digit ‘4’ Symbol Alt. Page Program cycle time (256 bytes) Page Program cycle time (n bytes, where ( ...

Page 43

Table 16. AC characteristics (25 MHz operation) Test conditions specified in Symbol Alt. Clock frequency for the following instructions FAST_READ, PP, SE, BE, DP, RES, WREN WRDI, RDSR, WRSR f Clock frequency for READ instructions R ...

Page 44

Table 16. AC characteristics (25 MHz operation) (continued) Test conditions specified in Symbol Alt. (5) t Sector Erase cycle time SE (5) t Bulk Erase cycle time must be greater than or equal to 1/ ...

Page 45

Figure 24. Write Protect setup and hold timing during WRSR when SRWD = 1 W tWHSL High Impedance Q Figure 25. Hold timing HOLD tHLCH tCHHL tCHHH tHLQZ tHHQX tSHWL AI07439 tHHCH AI02032 ...

Page 46

Figure 26. Output timing S C tCLQV tCLQX tCLQX Q ADDR.LSB IN D 46/56 tCH tCLQV tCL tQLQH tQHQL tSHQZ LSB OUT AI01449e ...

Page 47

Package mechanical In order to meet environmental requirements, Numonyx offers these devices in RoHS compliant packages, which have a Lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box ...

Page 48

Table 17. VFQFPN8 (MLP8) 8-lead very thin fine pitch quad flat package no lead, 6 × 5 mm, package mechanical data Symbol Typ A 0. 0.65 A3 0.20 b 0.40 D 6.00 D1 5.75 D2 3.40 E 5.00 ...

Page 49

Figure 28. VDFPN8 (MLP8) 8-lead very thin dual flat package no lead, 8 × 6 mm, package outline Drawing is not to scale. 2. The circle in the top view of the package indicates the ...

Page 50

Figure 29. SO8N – 8 lead plastic small outline, 150 mils body width, package outline A2 1. Drawing is not to scale. Table 19. SO8N – 8 lead plastic small outline, 150 mils body width, package mechanical data Symbol Typ ...

Page 51

Figure 30. SO8W – 8 lead plastic small outline, 208 mils body width, package outline Drawing is not to scale. Table 20. SO8 wide – 8 lead plastic small outline, 208 mils body width, ...

Page 52

Figure 31. SO16 wide – 16-lead plastic small outline, 300 mils body width, package outline B SO-H 1. Drawing is not to scale. Table 21. SO16 wide – 16-lead plastic small outline, 300 mils body width, mechanical data Symbol A ...

Page 53

Figure 32. PDIP8 – 8 lead Plastic Small Outline, 300 mils body width, package outline Package is not to scale. Table 22. PDIP8 – 8 lead Plastic Small Outline, 300 mils body width, package ...

Page 54

... Grade 3 is available only in devices delivered in SO8N packages. Note: For a list of available options (speed, package, etc.), for further information on any aspect of this device or when ordering parts operating at 75 MHz (0.11 μm, process digit ‘4’), please contact your nearest Numonyx Sales Office. 54/56 M25P16 – ...

Page 55

Revision history Table 24. Document revision history Date Revision 16-Jan-2002 0.1 23-Apr-2002 0.4 13-Dec-2002 0.5 0.6 15-May- 2003 0.7 20-Jun-2003 0.8 24-Sep-2003 1.0 24-Nov-2003 2.0 17-May- 3.0 2004 01-Apr-2005 4.0 01-Aug-2005 5.0 20-Oct-2005 6.0 27-Feb-2006 7 04-Jul-2006 8 Changes ...

Page 56

Table 24. Document revision history (continued) Date Revision 10-Oct-2006 9 09-Jan-2007 10 15-Jun-2007 11 31-Oct-2007 12 10-Dec-2007 13 20-Jun 2008 14 5-Dec-2008 15 56/56 Changes Page Program, Sector Erase and Bulk Erase updated in Features. V max modified in Table ...

Page 57

... Copies of documents which have an order number and are referenced in this document, or other Numonyx literature may be obtained by visiting Numonyx's website at http://www.numonyx.com. Numonyx StrataFlash is a trademark or registered trademark of Numonyx or its subsidiaries in the United States and other countries. *Other names and brands may be claimed as the property of others. ...

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