SC16C550BIN40,112 NXP Semiconductors, SC16C550BIN40,112 Datasheet - Page 45
![IC UART 40-DIP](/photos/6/98/69860/568-40-dip_sot129-1_sml.jpg)
SC16C550BIN40,112
Manufacturer Part Number
SC16C550BIN40,112
Description
IC UART 40-DIP
Manufacturer
NXP Semiconductors
Datasheet
1.SC16C550BIA44518.pdf
(48 pages)
Specifications of SC16C550BIN40,112
Features
Programmable
Number Of Channels
1, UART
Fifo's
16 Byte
Voltage - Supply
2.5V, 3.3V, 5V
With Auto Flow Control
Yes
With False Start Bit Detection
Yes
With Modem Control
Yes
With Cmos
Yes
Mounting Type
Through Hole
Package / Case
40-DIP (0.600", 15.24mm)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
935274386112
SC16C550BIN40
SC16C550BIN40
SC16C550BIN40
SC16C550BIN40
NXP Semiconductors
14. Abbreviations
SC16C550B_5
Product data sheet
13.4 Package related soldering information
Table 29.
[1]
[2]
Table 30.
Package
CPGA, HCPGA
DBS, DIP, HDIP, RDBS, SDIP, SIL
PMFP
Acronym
CMOS
CPU
DLL
DLM
DMA
FIFO
ISDN
LSB
MSB
TTL
UART
For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit
board.
For PMFP packages hot bar soldering or manual soldering is suitable.
[2]
Suitability of through-hole mount IC packages for dipping and wave soldering
Abbreviations
Description
Complementary Metal-Oxide Semiconductor
Central Processing Unit
Divisor Latch LSB
Divisor Latch MSB
Direct Memory Access
First-In, First-Out
Integrated Service Digital Network
Least Significant Bit
Most Significant Bit
Transistor-Transistor Logic
Universal Asynchronous Receiver and Transmitter
Rev. 05 — 1 October 2008
5 V, 3.3 V and 2.5 V UART with 16-byte FIFOs
Soldering method
Dipping
-
suitable
-
SC16C550B
Wave
suitable
suitable
not suitable
© NXP B.V. 2008. All rights reserved.
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