SA58631TK,118 NXP Semiconductors, SA58631TK,118 Datasheet
SA58631TK,118
Specifications of SA58631TK,118
935280877118
SA58631TK-T
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SA58631TK,118 Summary of contents
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SA58631 3 W BTL audio amplifier Rev. 02 — 12 October 2007 1. General description The SA58631 is a one channel audio amplifi HVSON8 package. It provides power output with an 8 (Bridge Tied Load) ...
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... NXP Semiconductors 4. Quick reference data Table otherwise specified. Symbol stb P o THD+N PSRR [1] With a load connected at the outputs the quiescent current will increase, the maximum of this increase being equal to the DC output offset voltage divided by R [2] Supply voltage ripple rejection is measured at the output with a source impedance of R The ripple voltage is a sine wave with a frequency of 1 kHz and an amplitude of 100 mV (RMS), which is applied to the positive supply rail ...
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... NXP Semiconductors 6. Block diagram Fig 1. Block diagram of SA58631 7. Pinning information 7.1 Pinning Fig 2. Pin configuration for HVSON8 SA58631_2 Product data sheet SA58631 IN SVR MODE STANDBY/MUTE LOGIC terminal 1 index area MODE 1 SVR 2 SA58631TK IN 002aac006 Transparent top view Rev. 02 — 12 October 2007 SA58631 3 W BTL audio amplifi ...
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... NXP Semiconductors 7.2 Pin description Table 3. Symbol MODE SVR IN+ IN OUT V CC GND OUT+ 8. Functional description The SA58631 is a single-channel BTL audio amplifier capable of delivering 3 W output power the device can be switched to standby and mute condition. The device is protected by an internal thermal shutdown protection mechanism ...
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... NXP Semiconductors 9. Limiting values Table 4. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter ORM T stg T amb V P(sc) P tot [1] AC and DC short-circuit safe voltage. 10. Thermal characteristics Table 5. Symbol R th(j-a) R th(j-sp) [1] Thermal resistance is 28 K/W with DAP soldered spreader. ...
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... NXP Semiconductors 11. Static characteristics Table 6. Static characteristics amb L Symbol Parameter V supply voltage CC I quiescent current q I standby current stb V output voltage O V differential output voltage offset O(offset) I input bias current on pin IN+ IB(IN+) I input bias current on pin IN IB( voltage on pin MODE MODE ...
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... NXP Semiconductors 13. Application information Fig 3. Application diagram of SA58631 BTL differential output configuration 14. Test information 14.1 Test conditions The junction to ambient thermal resistance, R when the exposed die attach paddle is soldered copper heat spreader on the demo PCB. The maximum sine wave power dissipation for ...
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... NXP Semiconductors 6 ( 4 5.0 10.0 Fig 4. Output power versus supply voltage @ 2 THD 14.2 BTL application amb 20 kHz. The BTL diagram is shown in The quiescent current has been measured without any load impedance. The total harmonic distortion + noise (THD+ function of frequency was measured with a low-pass fi ...
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... NXP Semiconductors 16 V MODE (V) 12 standby Fig 6. V versus V MODE CC 20 SVRR (dB) 40 (1) ( Fig 8. SVRR versus frequency SA58631_2 Product data sheet 002aac042 (mA) 10 mute 5 operating (V) CC Fig 7. I 002aac044 ( (Hz) = 100 mV. Band-pass = kHz. I (1) V (2) V (3) V Fig 9. V Rev. 02 — 12 October 2007 SA58631 3 W BTL audio amplifi ...
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... NXP Semiconductors 5.0 P ( 3.0 7.5 V 2.0 5 0.6 1.2 Fig 10. Power dissipation versus output power 4 dB; 9 heat spreader 3 9 (W) 2.0 7.5 V 1.0 5 1.0 2.0 Fig 12. Power dissipation versus output power 8 dB; 9 heat spreader 1 9 (W) 1.2 7.5 V 0.8 5.0 V ...
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... NXP Semiconductors 3 9 (W) 2.0 7.5 V 1.0 5 1.0 2.0 Fig 16. Power dissipation versus output power 8 dB heat spreader 2 10 THD+N (%) 7 kHz kHz Fig 18. THD+N versus output power SA58631_2 Product data sheet 002aac033 P (W) 3.0 4.0 P (W) o Fig 17. Power dissipation versus output power; ...
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... NXP Semiconductors 2.0 THD+N (%) 1.6 1.2 0.8 0 Fig 19. THD+N versus frequency SA58631_2 Product data sheet 002aac038 THD+N (%) (kHz 1.0 THD+N (%) 0.8 0.6 0.4 0 Rev. 02 — 12 October 2007 3 W BTL audio amplifier 1.2 0.8 0 (kHz 002aac040 (kHz) SA58631 002aac039 1 10 © NXP B.V. 2007. All rights reserved. ...
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... NXP Semiconductors 14.3 Single-ended application amb 20 kHz. The Single-Ended (SE) application diagram is shown in Fig 20. SE application circuit configuration The capacitor value combination with the load impedance determines the low frequency behavior. The total harmonic distortion + noise as a function of frequency was measured with a low-pass filter of 80 kHz. The value of the capacitor C2 influences the behavior of the PSRR at low frequencies ...
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... NXP Semiconductors 14.5 SA58631TK PCB demo The application demo board may be used for evaluation in either BTL or SE configuration as shown in the schematics top layer GND INPUT Fig 21. SA58631TK PCB demo SA58631_2 Product data sheet Figure heat spreader (total of top and bottom heat spreader area). ...
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... NXP Semiconductors 15. Package outline HVSON8: plastic thermal enhanced very thin small outline package; no leads; 8 terminals; body 0. terminal 1 index area terminal 1 index area DIMENSIONS (mm are the original dimensions) (1) A UNIT max. 0.05 0 0.2 0.00 0.3 Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. ...
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... NXP Semiconductors 16. Soldering This text provides a very brief insight into a complex technology. A more in-depth account of soldering ICs can be found in Application Note AN10365 “Surface mount reflow soldering description” . 16.1 Introduction to soldering Soldering is one of the most common methods through which packages are attached to Printed Circuit Boards (PCBs), to form electrical circuits ...
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... NXP Semiconductors 16.4 Reflow soldering Key characteristics in reflow soldering are: • Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to higher minimum peak temperatures (see reducing the process window • Solder paste printing issues including smearing, release, and adjusting the process window for a mix of large and small components on one board • ...
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... NXP Semiconductors Fig 23. Temperature profiles for large and small components For further information on temperature profiles, refer to Application Note AN10365 “Surface mount reflow soldering description” . 17. Abbreviations Table 10. Acronym BTL CMOS DAP ESD NPN PCB PNP RMS THD SA58631_2 Product data sheet ...
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... Release date SA58631_2 20071012 • Modifications: The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • Legal texts have been adapted to the new company name where appropriate. • Figure • Soldering information updated ...
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... For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail ...
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... NXP Semiconductors 21. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 4 Quick reference data . . . . . . . . . . . . . . . . . . . . . 2 5 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 6 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3 7 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 7.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 7.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 8 Functional description . . . . . . . . . . . . . . . . . . . 4 8.1 Power amplifi 8.2 Mode select pin (MODE Limiting values Thermal characteristics ...