SA58631 NXP Semiconductors, SA58631 Datasheet
SA58631
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SA58631 Summary of contents
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... W BTL audio amplifier Rev. 02 — 12 October 2007 1. General description The SA58631 is a one channel audio amplifi HVSON8 package. It provides power output with an 8 (Bridge Tied Load) amplifier with a complementary PNP-NPN output stage and standby/mute logic. The SA58631 is housed in an 8-pin HVSON package which has an exposed die attach paddle enabling reduced thermal resistance and increased power dissipation ...
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... Ordering information Package Name Description HVSON8 plastic thermal enhanced very thin small outline package; no leads; 8 terminals; body 0.85 mm Rev. 02 — 12 October 2007 SA58631 3 W BTL audio amplifi measured in test circuit MODE Conditions Min Typ operating 2.2 ...
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... NXP Semiconductors 6. Block diagram Fig 1. Block diagram of SA58631 7. Pinning information 7.1 Pinning Fig 2. Pin configuration for HVSON8 SA58631_2 Product data sheet SA58631 IN SVR MODE STANDBY/MUTE LOGIC terminal 1 index area MODE 1 SVR 2 SA58631TK IN 002aac006 Transparent top view Rev. 02 — ...
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... GND OUT+ 8. Functional description The SA58631 is a single-channel BTL audio amplifier capable of delivering 3 W output power the device can be switched to standby and mute condition. The device is protected by an internal thermal shutdown protection mechanism. The gain can be set within a range external feedback resistors. 8.1 Power amplifi ...
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... Thermal characteristics Parameter thermal resistance from junction to ambient thermal resistance from junction to solder point Rev. 02 — 12 October 2007 SA58631 3 W BTL audio amplifier Conditions Min Max operating 0.3 +18 0 ...
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... Min Typ 1 1.2 0.6 0.9 - 3.0 - 0.15 [ 100 [ [ [ [ the input. The ripple voltage the input. The ripple voltage SA58631 Max Unit 500 nA 500 Max Unit - ...
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... NXP Semiconductors 13. Application information Fig 3. Application diagram of SA58631 BTL differential output configuration 14. Test information 14.1 Test conditions The junction to ambient thermal resistance, R when the exposed die attach paddle is soldered copper heat spreader on the demo PCB. The maximum sine wave power dissipation for ...
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... The following characterization curves show the room temperature performance for SA58631 using the demo PCB shown in versus output power spreader area, load resistance and voltage gain show that there is very little difference in performance with voltage gain ...
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... Band-pass = kHz. I (1) V (2) V (3) V Fig 9. V Rev. 02 — 12 October 2007 SA58631 3 W BTL audio amplifier 002aac043 versus 002aac045 (1) (2) ( MODE = ...
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... P (W) o Fig 13. Power dissipation versus output power (1 002aac031 1.6 P (W) 1.2 0.8 0.4 2.0 3.0 P (W) o Fig 15. Power dissipation versus output power (1 Rev. 02 — 12 October 2007 SA58631 3 W BTL audio amplifi 9 7 0.6 1 dB; 9 heat spreader 7 1.0 2.0 3 8.0 ...
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... W BTL audio amplifi 1.2 7.5 V 0.8 5 1 heat spreader 5 7 002aac037 (W) o SA58631 002aac034 3 002aac036 (W) o © NXP B.V. 2007. All rights reserved ...
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... Fig 19. THD+N versus frequency SA58631_2 Product data sheet 002aac038 THD+N (%) (kHz 1.0 THD+N (%) 0.8 0.6 0.4 0 Rev. 02 — 12 October 2007 3 W BTL audio amplifier 1.2 0.8 0 (kHz 002aac040 (kHz) SA58631 002aac039 1 10 © NXP B.V. 2007. All rights reserved ...
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... SVR 2 MODE Gain = ------ - R1 Rev. 02 — 12 October 2007 SA58631 3 W BTL audio amplifi dB; audio band-pass Figure 20. 100 OUT 5 470 F SA58631 R L OUT GND © NXP B.V. 2007. All rights reserved 100 F 002aac041 ...
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... The application demo board may be used for evaluation in either BTL or SE configuration as shown in the schematics top layer GND INPUT Fig 21. SA58631TK PCB demo SA58631_2 Product data sheet Figure heat spreader (total of top and bottom heat spreader area). SA58631TK 6.8 k Rev3 6.8 k OUT+ OUT ...
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... JEDEC JEITA MO-229 Rev. 02 — 12 October 2007 3 W BTL audio amplifi scale detail exposed tie bar ( 0.65 0.05 0.1 0.1 0.05 0.40 EUROPEAN PROJECTION SA58631 SOT909 ISSUE DATE 05-09-26 05-09-28 © NXP B.V. 2007. All rights reserved ...
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... Solder bath specifications, including temperature and impurities SA58631_2 Product data sheet Rev. 02 — 12 October 2007 SA58631 3 W BTL audio amplifier © NXP B.V. 2007. All rights reserved ...
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... Lead-free process (from J-STD-020C) Package reflow temperature ( C) 3 Volume (mm ) < 350 260 260 250 Figure 23. Rev. 02 — 12 October 2007 SA58631 3 W BTL audio amplifier Figure 23) than a PbSn process, thus 350 220 220 350 to 2000 > 2000 260 260 250 245 ...
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... Bridge Tied Load Complementary Metal Oxide Silicon Die Attach Paddle ElectroStatic Discharge Negative-Positive-Negative Printed-Circuit Board Positive-Negative-Positive Root Mean Squared Total Harmonic Distortion Rev. 02 — 12 October 2007 SA58631 3 W BTL audio amplifier peak temperature time 001aac844 © NXP B.V. 2007. All rights reserved ...
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... Soldering information updated SA58631_1 20060308 SA58631_2 Product data sheet Data sheet status Product data sheet 4: changed incorrect character font Product data sheet Rev. 02 — 12 October 2007 SA58631 3 W BTL audio amplifier Change notice Supersedes - SA58631_1 - - © NXP B.V. 2007. All rights reserved ...
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... Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. http://www.nxp.com salesaddresses@nxp.com Rev. 02 — 12 October 2007 SA58631 3 W BTL audio amplifier © NXP B.V. 2007. All rights reserved ...
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... Static characteristics Dynamic characteristics . . . . . . . . . . . . . . . . . . 6 13 Application information Test information . . . . . . . . . . . . . . . . . . . . . . . . . 7 14.1 Test conditions . . . . . . . . . . . . . . . . . . . . . . . . . 7 14.2 BTL application . . . . . . . . . . . . . . . . . . . . . . . . . 8 14.3 Single-ended application . . . . . . . . . . . . . . . . 13 14.4 General remarks . . . . . . . . . . . . . . . . . . . . . . . 13 14.5 SA58631TK PCB demo . . . . . . . . . . . . . . . . . 14 15 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 15 16 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 16.1 Introduction to soldering . . . . . . . . . . . . . . . . . 16 16.2 Wave and reflow soldering . . . . . . . . . . . . . . . 16 16.3 Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 16 16.4 Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 17 17 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 18 18 Revision history ...