SA58631 NXP Semiconductors, SA58631 Datasheet - Page 18
SA58631
Manufacturer Part Number
SA58631
Description
Manufacturer
NXP Semiconductors
Datasheet
1.SA58631.pdf
(21 pages)
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NXP Semiconductors
17. Abbreviations
SA58631_2
Product data sheet
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description” .
Table 10.
Acronym
BTL
CMOS
DAP
ESD
NPN
PCB
PNP
RMS
THD
Fig 23. Temperature profiles for large and small components
MSL: Moisture Sensitivity Level
temperature
Abbreviations
Description
Bridge Tied Load
Complementary Metal Oxide Silicon
Die Attach Paddle
ElectroStatic Discharge
Negative-Positive-Negative
Printed-Circuit Board
Positive-Negative-Positive
Root Mean Squared
Total Harmonic Distortion
Rev. 02 — 12 October 2007
= minimum soldering temperature
maximum peak temperature
minimum peak temperature
= MSL limit, damage level
temperature
3 W BTL audio amplifier
peak
SA58631
© NXP B.V. 2007. All rights reserved.
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time
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