SA58631 NXP Semiconductors, SA58631 Datasheet - Page 14

• Manufacturer Part Number: SA58631
• Manufacturer: NXP Semiconductors

NXP Semiconductors
SA58631_2
Product data sheet
Fig 21. SA58631TK PCB demo
INPUT
GND
MS
14.5 SA58631TK PCB demo
11 k
47 F
The application demo board may be used for evaluation in either BTL or SE configuration
as shown in the schematics in
32 cm
P1
top layer
2
(5 in
SA58631TK
2
) heat spreader (total of top and bottom heat spreader area).
Rev3
6.8 k
6.8 k
Rev. 02 — 12 October 2007
OUT+
OUT
V
GND
CC
Figure 3
and
Figure
20. The demo PCB is laid out for the
bottom layer
3 W BTL audio amplifier
SA58631
© NXP B.V. 2007. All rights reserved.
002aac047
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