TDA8920CJ/N1,112 NXP Semiconductors, TDA8920CJ/N1,112 Datasheet - Page 39

• Manufacturer Part Number: TDA8920CJ/N1,112
• Description: IC AMP AUDIO PWR 220W 23SIL
• Manufacturer: NXP Semiconductors
• Type: Class Dr

Specifications of TDA8920CJ/N1,112

• Output Type: 1-Channel (Mono) or 2-Channel (Stereo)
• Package / Case: 23-SIL (Bent and Staggered Leads)
• Max Output Power X Channels @ Load: 220W x 1 @ 8 Ohm; 125W x 2 @ 4 Ohm
• Voltage - Supply: ±12.5 V ~ 32.5 V
• Features: Depop, Differential Inputs, Mute, Short-Circuit and Thermal Protection, Standby
• Mounting Type: Through Hole
• Product: Class-D
• Output Power: 210 W
• Available Set Gain: 36 dB
• Common Mode Rejection Ratio (min): 75 dB
• Thd Plus Noise: 0.05 %
• Maximum Operating Temperature: + 85 C
• Mounting Style: Through Hole
• Audio Load Resistance: 8 Ohms
• Dual Supply Voltage: +/- 30 V
• Input Signal Type: Differential
• Minimum Operating Temperature: - 40 C
• Output Signal Type: Differential, Single
• Supply Type: Dual
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 568-4784-5; 935281808112; TDA8920CJ/N1; TDA8920CJ/N1,112; TDA8920CJ/N1

NXP Semiconductors
20. Contents
1
2
3
4
5
6
7
7.1
7.2
8
8.1
8.2
8.3
8.3.1
8.3.1.1
8.3.1.2
8.3.2
8.3.3
8.3.4
8.4
9
10
11
12
12.1
12.2
12.3
13
13.1
13.2
13.3
13.3.1
13.3.2
13.4
13.5
13.6
13.7
13.8
14
15
15.1
15.2
15.3
15.4
16
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Quick reference data . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pinning information . . . . . . . . . . . . . . . . . . . . . . 4
Functional description . . . . . . . . . . . . . . . . . . . 5
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 12
Thermal characteristics. . . . . . . . . . . . . . . . . . 12
Static characteristics. . . . . . . . . . . . . . . . . . . . 13
Dynamic characteristics . . . . . . . . . . . . . . . . . 14
Application information. . . . . . . . . . . . . . . . . . 17
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 32
Soldering of SMD packages . . . . . . . . . . . . . . 34
Soldering of through-hole mount packages . 36
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 5
General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Pulse-width modulation frequency . . . . . . . . . . 8
Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Thermal protection . . . . . . . . . . . . . . . . . . . . . . 8
Thermal FoldBack (TFB) . . . . . . . . . . . . . . . . . 8
OverTemperature Protection (OTP) . . . . . . . . . 9
OverCurrent Protection (OCP) . . . . . . . . . . . . . 9
Window Protection (WP). . . . . . . . . . . . . . . . . 10
Supply voltage protection . . . . . . . . . . . . . . . . 11
Differential audio inputs . . . . . . . . . . . . . . . . . 11
Switching characteristics . . . . . . . . . . . . . . . . 14
Stereo SE configuration characteristics . . . . . 15
Mono BTL application characteristics . . . . . . . 16
Mono BTL application . . . . . . . . . . . . . . . . . . . 17
Pin MODE. . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Estimating the output power . . . . . . . . . . . . . . 17
Single-Ended (SE) . . . . . . . . . . . . . . . . . . . . . 17
Bridge-Tied Load (BTL) . . . . . . . . . . . . . . . . . 18
External clock . . . . . . . . . . . . . . . . . . . . . . . . . 18
Heatsink requirements . . . . . . . . . . . . . . . . . . 19
Pumping effects . . . . . . . . . . . . . . . . . . . . . . . 20
Application schematic . . . . . . . . . . . . . . . . . . . 21
Curves measured in reference design . . . . . . 23
Introduction to soldering . . . . . . . . . . . . . . . . . 34
Wave and reflow soldering . . . . . . . . . . . . . . . 34
Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 34
Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 35
16.1
16.2
16.3
16.4
17
18
18.1
18.2
18.3
18.4
19
20
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2009.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [e-mail]
Revision history . . . . . . . . . . . . . . . . . . . . . . . 37
Legal information . . . . . . . . . . . . . . . . . . . . . . 38
Contact information . . . . . . . . . . . . . . . . . . . . 38
Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
Introduction to soldering through-hole mount
packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
Soldering by dipping or by solder wave . . . . . 36
Manual soldering . . . . . . . . . . . . . . . . . . . . . . 36
Package related soldering information . . . . . . 37
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 38
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 38
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . 38
2
110 W class-D power amplifier
TDA8920C
Document identifier: TDA8920C_2
Date of release: 11 June 2009
All rights reserved.