TDA1910HS STMicroelectronics, TDA1910HS Datasheet - Page 12

• Manufacturer Part Number: TDA1910HS
• Description: IC AMP AUD 10W MULTIWATT11 HORZ
• Manufacturer: STMicroelectronics
• Type: Class ABr

Specifications of TDA1910HS

• Output Type: 1-Channel (Mono)
• Max Output Power X Channels @ Load: 17W x 1 @ 4 Ohm
• Voltage - Supply: 8 V ~ 30 V
• Features: Depop, Mute, Thermal Protection
• Mounting Type: Through Hole
• Package / Case: Multiwatt-11 (Horizontal, Bent and Staggered Leads)
• Operational Class: Class-AB
• Audio Amplifier Output Configuration: 1-Channel Mono
• Output Power (typ): 17x1@4OhmW
• Audio Amplifier Function: Speaker
• Total Harmonic Distortion: 0.2@8Ohm@7W%
• Single Supply Voltage (typ): 9/12/15/18/24/28V
• Dual Supply Voltage (typ): Not RequiredV
• Power Supply Requirement: Single
• Power Dissipation: 20W
• Rail/rail I/o Type: No
• Power Supply Rejection Ratio: 60dB
• Single Supply Voltage (min): 8V
• Single Supply Voltage (max): 30V
• Dual Supply Voltage (min): Not RequiredV
• Dual Supply Voltage (max): Not RequiredV
• Operating Temp Range: -40C to 150C
• Operating Temperature Classification: Automotive
• Mounting: Through Hole
• Pin Count: 11 +Tab
• Package Type: MULTIWATT H
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 497-8860-5; TDA1910HS

THERMAL SHUT-DOWN
The presence of a thermal limiting circuit offers the
following advantages:
1) An overload on the output (even if it is perma-
2) The heatskink can have a smaller factor of
Figure 29. Output power and
dr ai n c urr en t vs.
temperature
MOUNTING INSTRUCTIONS
The power dissipated in the circuit must be re-
moved by adding an external heatsink.
Thanks to the Multiwatt® package attaching the
heatsink is very simple, a screw or a compression
TDA1910
12/15
nent), or an above limit ambient temperature
can be easily supported since the T
higher than 150 C.
safety compared with that of a conventional
case
Figure 30. Output power and
dra i n cu rre nt vs. case
temperature
j
cannot be
The maximum allowable power dissipation de-
pends upon the size of the external heatsink (i.e. its
thermal resistance); fig. 31 shows this dissipable
power as a function of ambient temperature for
different thermal resistance.
spring (clip) being sufficient. Between the heatsink
and the package it is better to insert a layer of silicon
grease, to optimize the thermal contact; no electri-
cal isolation is needed between the two surfaces.
circuit. There is no possibility of device damage
due to high junction temperature.
If for any reason, the junction temperature in-
creases up to 150 C, the thermal shut-down
simply reduces the power dissipation and the
current consumption.
Figure 31. Maximum allow able
power dissipation vs. ambient
temperature