ADSP-21266SKBCZ-2B Analog Devices Inc, ADSP-21266SKBCZ-2B Datasheet - Page 43

• Manufacturer Part Number: ADSP-21266SKBCZ-2B
• Manufacturer: Analog Devices Inc

Specifications of ADSP-21266SKBCZ-2B

• Device Core Size: 32b
• Architecture: Super Harvard
• Format: Floating Point
• Clock Freq (max): 200MHz
• Mips: 200
• Device Input Clock Speed: 200MHz
• Ram Size: 256KB
• Program Memory Size: 512KB
• Operating Supply Voltage (typ): 1.2/3.3V
• Operating Supply Voltage (min): 1.14/3.13V
• Operating Supply Voltage (max): 1.26/3.47V
• Operating Temp Range: 0C to 70C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Pin Count: 136
• Lead Free Status / Rohs Status: Compliant

SURFACE-MOUNT DESIGN
Table 42
standard design recommendations, refer to IPC-7351, Generic
Requirements for Surface-Mount Design and Land Pattern
Standard.
Table 42. BGA_ED Data for Use with Surface-Mount Design
Package
136-Ball CSP_BGA (BC-136)
is provided as an aide to PCB design. For industry-
1.70 MAX
Ball Attach Type
Solder Mask Defined (SMD)
Figure 35. 136-Ball Chip Scale Package Ball Grid Array [CSP_BGA]
DETAIL A
BALL A1
INDICATOR
TOP VIEW
12.10
12.00 SQ
11.90
* COMPLIANT WITH JEDEC STANDARDS MO-205-AE
WITH EXCEPTION TO BALL DIAMETER.
Dimensions shown in millimeters
Rev. F | Page 43 of 44 | July 2009
0.25 MIN
(BC-136)
BSC SQ
10.40
BALL DIAMETER
* 0.50
14
0.45
0.40
ADSP-21261/ADSP-21262/ADSP-21266
13
Solder Mask Opening
0.4 mm
12
DETAIL A
11
BOTTOM VIEW
0.80 BSC
10
9
8
7
INDEX AREA
6
A1 CORNER
5
SEATING
PLANE
4
3
2
1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
1.31
1.21
1.10
0.12 MAX
COPLANARITY
Ball Pad Size
0.53 mm