U1ZB6.8 TOSHIBA Semiconductor CORPORATION, U1ZB6.8 Datasheet
U1ZB6.8
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U1ZB6.8 Summary of contents
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... Surface Mounting Plastic Mold Package MAXIMUM RATINGS (Ta = 25°C) CHARACTERISTIC Power Dissipation Junction Temperature Storage Temperature Range STANDARD SOLDERING PAD = 6.8~390 V Z SYMBOL RATING UNIT P 1 −40~150 T stg −40~150 MARK 1 U1ZB6.8~U1ZB390 W °C °C JEDEC ― JEITA ― TOSHIBA 3−4D1A Weight: 0.06g 2001-07-11 Unit: mm ...
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... U1ZB6.8~U1ZB390 FORWARD REVERSE VOLTAGE CURRENT MEASURE− ( (µA) MENT CURRENT MAX MAX MAX I ( 1.2 0 1.2 0 1.2 0 ...
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... U1ZB6.8~U1ZB390 FORWARD REVERSE VOLTAGE CURRENT MEASURE− MEASURE− (µA) F MENT MENT CURRENT VOLTAGE MAX MAX I ( 216 234 1 ...
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... U1ZB6.8~U1ZB390 4 2001-07-11 ...
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... TOSHIBA CORPORATION for any infringements of intellectual property or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any intellectual property or other rights of TOSHIBA CORPORATION or others. · The information contained herein is subject to change without notice. U1ZB6.8~U1ZB390 5 000707EAA 2001-07-11 ...