TCD1304DG TOSHIBA Semiconductor CORPORATION, TCD1304DG Datasheet
TCD1304DG
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TCD1304DG Summary of contents
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... Digital Power Supply Analog Power Supply Operating Temperature Storage Temperature Note: All voltage are with respect to SS terminals. (Ground) TCD1304DG SYMBOL RATING UNIT V φ −0.3 ICG −25~60 ° C opr T −40~100 ° C stg 1 TCD1304DG Weight: (3.5g (Typ.)) PIN CONNECTION (TOP VIEW) 2004-01-06 ...
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... CIRCUIT DIAGRAM PIN NAMES M Master Clock φ SH Shift Gate ICG Integration Clear Gate V Power (Analog Power (Digital Ground NC Non Connection 2 TCD1304DG 2004-01-06 ...
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... RI V SAT V MDK TTE VLAGICG ∆ χ 100 % × χ is the maximum deviation from ∆ χ 100 % × χ 3 TCD1304DG MIN TYP. MAX UNIT 110 160 ― lx·s ― ― ― ― 450 600 ― mV ― ― % 300 ― ― ― ...
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... V SAT Note 6: Definition MDK V is proportional to t MDK INT So the shorter t condition makes wider DR value. INT V SAT Note 7: Definition Note 8: DC signal output voltage is defined as follows: . (Integration time · 4 TCD1304DG 2004-01-06 ...
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... Level “H” Level “L” Level “H” Level V “L” Level DD −0.5V DD (Ta = 25° ≥4.0V SYMBOL f C > (Ta = 25° C) (4. SYMBOL f 5 TCD1304DG MIN TYP. MAX UNIT 3.0 4.0 5.5 V φ 0.44 3.0 4.0 5 0.44 3.0 4.0 5.5 ICG ...
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... TIMING CHART TCD1304DG−6 ...
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... TIMING CHART (Use electric shutter function) TCD1304DG−7 ...
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... Pulse Timing of ICG and Pulse Width Pulse Timing of ICG and φ You keep M “High” Level. φ Note: If you use electronic shutter function. t SYMBOL (MIN.) = 10µs INT 8 TCD1304DG MIN TYP. MAX UNIT 1000 5000 ― ns 100 500 1000 ns 1000 ns ― ― ...
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... USE ELECTRONIC SHUTTER • t (MIN.) = 10µs INT You have always same SH pulse width (t3). 9 TCD1304DG 2004-01-06 ...
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... TYPICAL PERFOMANCE CURVES 10 TCD1304DG 2004-01-06 ...
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... TYPICAL PERFOMANCE CURVES 11 TCD1304DG 2004-01-06 ...
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... TYPICAL DRIVE CIRCUIT TCD1304D TCD1304D TCD1304D TCD1304D 12 TCD1304DG 2004-01-06 ...
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... CAUTION 1. Window Glass 2. Electrostatic Breakdown 3. Incident Light 4. Lead Frame Forming 5. Soldering 13 TCD1304DG 2004-01-06 ...
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... PACKAGE DIMENSIONS Note 1: No. 1 SENSOR ELEMENT (S1) TO EDGE OF PACKAGE. Note 2: TOP OF CHIP TO BOTTOM OF PACKAGE. Note 3: GLASS THICKNES (n = 1.5) Weight: (3.5g (Typ.)) 14 TCD1304DG Unit : mm 2004-01-06 ...
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... TOSHIBA CORPORATION for any infringements of intellectual property or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any intellectual property or other rights of TOSHIBA CORPORATION or others. • The information contained herein is subject to change without notice. 15 TCD1304DG 000707EBA 2004-01-06 ...