BGR269,112 NXP Semiconductors, BGR269,112 Datasheet
BGR269,112
Specifications of BGR269,112
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BGR269,112 Summary of contents
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BGR269 200 MHz gain reverse amplifier Rev. 6 — 5 August 2010 1. Product profile 1.1 General description High performance amplifier in a SOT115J package, operating at a voltage supply (DC). CAUTION This device is ...
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... NXP Semiconductors 2. Pinning information Table 2. Pin Ordering information Table 3. Type number BGR269 4. Limiting values Table 4. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol stg BGR269 Product data sheet Pinning Description input common common +V B common common output Ordering information ...
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... NXP Semiconductors 5. Characteristics Table 5. Characteristics Bandwidth 5 MHz to 200 MHz Symbol Parameter G power gain p SL slope straight line FL flatness of frequency response MHz to 10 MHz s input return losses 11 s output return losses 22 ϕ phase response s21 s reverse isolation 12 CTB composite triple beat X cross modulation ...
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... NXP Semiconductors 6. Package outline Rectangular single-ended package; aluminium flange; 2 vertical mounting holes 6-32 UNC and 2 extra horizontal mounting holes; 7 gold-plated in-line leads DIMENSIONS (mm are the original dimensions UNIT b c max. max. max. 0.51 mm 20.8 9.5 0.25 27.2 0.38 OUTLINE VERSION IEC SOT115J Fig 1 ...
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... Release date BGR269 v.6 20100805 • Modifications: The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • Legal texts have been adapted to the new company name where appropriate. • Table 5 “Characteristics” BGR269_5 20050530 ...
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... In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or ...
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... NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any 9. Contact information For more information, please visit: ...
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... NXP Semiconductors 10. Contents 1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 General description . . . . . . . . . . . . . . . . . . . . . 1 1.2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 1 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Limiting values Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 3 6 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 4 7 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 5 8 Legal information 8.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 6 8 ...