E-TDA7342NTR STMicroelectronics, E-TDA7342NTR Datasheet - Page 18

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E-TDA7342NTR

Manufacturer Part Number
E-TDA7342NTR
Description
IC AUDIO PROCESSOR 32-LQFP
Manufacturer
STMicroelectronics
Type
Audio Processorr
Datasheet

Specifications of E-TDA7342NTR

Mounting Type
Surface Mount
Package / Case
32-LQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Applications
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
E-TDA7342NTR
Manufacturer:
STMicroelectronics
Quantity:
10 000
Package information
5
18/20
Package information
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label.
ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.
Figure 7.
DIM.
ccc
A1
A2
D1
D3
E1
E3
L1
A
D
K
b
c
E
e
L
LQFP32 Mechanical data & package dimensions
0.050
1.350
0.300
0.090
8.800
6.800
8.800
6.800
0.450
MIN.
1.400
0.370
9.000
7.000
5.600
9.000
7.000
5.600
0.800
0.600
1.000
3.500
TYP.
mm
MAX.
1.600
0.150 0.0020
1.450 0.0531 0.0551 0.0571
0.450 0.0118 0.0146 0.0177
0.200 0.0035
9.200 0.3465 0.3543 0.3622
7.200 0.2677 0.2756 0.2835
9.200 0.3465 0.3543 0.3622
7.200 0.2677 0.2756 0.2835
0.750 0.0177 0.0236 0.0295
7.000
0.100
MIN.
0.2205
0.2205
0.0315
0.0394
0.1378 0.2756
TYP.
inch
0.0630
0.0059
0.0079
0.0039
MAX.
Weight: 0.20gr
LQFP32 (7 x 7 x 1.40mm)
MECHANICAL DATA
OUTLINE AND
0060661 D
TDA7342

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