SA58635 NXP Semiconductors, SA58635 Datasheet - Page 27

• Manufacturer Part Number: SA58635
• Manufacturer: NXP Semiconductors

NXP Semiconductors
16. Abbreviations
17. Revision history
Table 17.
SA58635_1
Product data sheet
Document ID
SA58635_1
Revision history
15.3.4 Cleaning
Device removal can be done when the substrate is heated until it is certain that all solder
joints are molten. The chip can then be carefully removed from the substrate without
damaging the tracks and solder lands on the substrate. Removing the device must be
done using plastic tweezers, because metal tweezers can damage the silicon. The
surface of the substrate should be carefully cleaned and all solder and flux residues
and/or underfill removed. When a new chip is placed on the substrate, use the flux
process instead of solder on the solder lands. Apply flux on the bumps at the chip side as
well as on the solder pads on the substrate. Place and align the new chip while viewing
with a microscope. To reflow the solder, use the solder profile shown in application note
AN10365 “Surface mount reflow soldering description”.
Cleaning can be done after reflow soldering.
Table 16.
Acronym
ASIP
DVD
ESD
ESR
FB
HP
I
PC
PCB
2
C-bus
20100326
Release date
Abbreviations
Description
Application Specific Instruction-set Processor
Digital Versatile Disk
ElectroStatic Discharge
Equivalent Series Resistance
FeedBack
HeadPhone
Inter-integrated Circuit bus
Personal Computer
Printed-Circuit Board
Data sheet status
Product data sheet
Rev. 01 — 26 March 2010
2 × 25 mW class-G stereo headphone driver
Change notice
-
Supersedes
-
SA58635
© NXP B.V. 2010. All rights reserved.
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