BYC10B-600 NXP Semiconductors, BYC10B-600 Datasheet

Hyperfast power diode in a SOT404 (D2PAK) surface-mountable plastic package

BYC10B-600

Manufacturer Part Number
BYC10B-600
Description
Hyperfast power diode in a SOT404 (D2PAK) surface-mountable plastic package
Manufacturer
NXP Semiconductors
Datasheet

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Part Number
Manufacturer
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Part Number:
BYC10B-600
Manufacturer:
NXP
Quantity:
72 000
Part Number:
BYC10B-600
Manufacturer:
NXP/恩智浦
Quantity:
20 000
DISCRETE SEMICONDUCTORS
D D ATA SHEET
BYC10B-600
Rectifier diode
ultrafast, low switching loss
Product specification
March 2001

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BYC10B-600 Summary of contents

Page 1

... D D ATA SHEET BYC10B-600 Rectifier diode ultrafast, low switching loss Product specification DISCRETE SEMICONDUCTORS March 2001 ...

Page 2

... MOSFET APPLICATIONS • Active power factor correction • Half-bridge lighting ballasts • Half-bridge/ full-bridge switched mode power supplies. The BYC10B-600 is supplied in the SOT404 surface mounting package. LIMITING VALUES Limiting values in accordance with the Absolute Maximum System (IEC 134). SYMBOL PARAMETER ...

Page 3

... /dt = 100 A/μ Vin Vin = 400 V d. 400 V d.c. OUTPUT DIODE Fig.2. Typical application, freewheeling diode in half bridge converter. Continuous conduction mode, where each transistor turns on whilst forward current is still 2 Product specification BYC10B-600 MIN. TYP. - 1.4 - 1 1.1 / A/μ ...

Page 4

... Rate of change of current, dIF/dt (A/us) of rate of change of current dI Peak reverse recovery current, Irrm (A) 100 125 400 V 1 100 Rate of change of current, dIF/dt (A/us) function of rate of change of current dI BYC10B-600 BYC10-600 1000 , as a function rr /dt. F BYC10-600 1000 as a rrm /dt. F Rev 1.400 ...

Page 5

... Fig.13. Typical reverse leakage current as a function fr /dt. of reverse voltage time 0.1 0. 0.001 1us time Fig.14. Maximum thermal impedance Product specification BYC10B-600 max typ Forward voltage 25˚C and 150˚ 125 C 100 100 ...

Page 6

... Dimensions in mm Net Mass: 1.4 g MOUNTING INSTRUCTIONS Dimensions in mm Notes 1. Plastic meets UL94 V0 at 1/8". March 2001 10.3 max 11 max 0.85 max (x2) 2.54 (x2) Fig.15. SOT404 : centre pin connected to mounting base. 9.0 2.0 3.8 Fig.16. SOT404 : minimum pad sizes for surface mounting. 5 Product specification 4.5 max 1.4 max 15.4 0.5 11.5 17.5 5.08 BYC10B-600 2.5 Rev 1.400 ...

Page 7

... In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the ...

Page 8

... Customer notification This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal definitions and disclaimers. No changes were made to the content, except for the legal definitions and disclaimers. Contact information For additional information please visit: http://www ...

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