BAT54J NXP Semiconductors, BAT54J Datasheet - Page 5

• Manufacturer Part Number: BAT54J
• Description: Planar Schottky barrier single diode with an integrated guard ring for stress protection,encapsulated in a SOD323F (SC-90) very small and flat lead Surface-Mounted Device(SMD) plastic package
• Manufacturer: NXP Semiconductors

NXP Semiconductors
8. Package outline
9. Packing information
10. Soldering
BAT54J_1
Product data sheet
Table 8.
The indicated -xxx are the last three digits of the 12NC ordering code.
[1]
Type number
BAT54J
Fig 4. Package outline SOD323F (SC-90)
Fig 5. Reflow soldering footprint SOD323F (SC-90)
For further information and the availability of packing methods, see
Reflow soldering is the only recommended soldering method.
Dimensions in mm
1.65
Packing methods
0.95
Package
SOD323F
Dimensions in mm
0.50
(2 )
Rev. 01 — 8 March 2007
2.7
2.3
1.8
1.6
3.05
2.80
2.10
1.60
Description
4 mm pitch, 8 mm tape and reel
1.35
1.15
1
2
0.40
0.25
0.50
001aab169
0.60
0.5
0.3
Section
0.80
0.65
Schottky barrier single diode
0.25
0.10
[1]
04-09-13
13.
Packing quantity
3000
-115
solder lands
solder resist
occupied area
solder paste
© NXP B.V. 2007. All rights reserved.
BAT54J
10000
-135
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