PMEG3010BEP NXP Semiconductors, PMEG3010BEP Datasheet - Page 10

• Manufacturer Part Number: PMEG3010BEP
• Description: Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with anintegrated guard ring for stress protection, encapsulated in a SOD128 small and flat leadSurface-Mounted Device (SMD) plastic package
• Manufacturer: NXP Semiconductors

NXP Semiconductors
10. Packing information
11. Soldering
PMEG3010BEP_1
Product data sheet
Table 8.
The indicated -xxx are the last three digits of the 12NC ordering code.
[1]
Type number
PMEG3010BEP
Fig 15. Reflow soldering footprint SOD128
For further information and the availability of packing methods, see
3.4
Reflow soldering is the only recommended soldering method.
2.5
Packing methods
Package
SOD128
(2 )
(2 )
1.2
1.4
Rev. 01 — 20 April 2009
Description
4 mm pitch, 12 mm tape and reel
6.2
4.4
4.2
1 A low V
F
(2 )
MEGA Schottky barrier rectifier
1.9
PMEG3010BEP
Section
(2 )
2.1
[1]
14.
Dimensions in mm
Packing quantity
3000
-115
© NXP B.V. 2009. All rights reserved.
solder lands
solder resist
solder paste
occupied area
sod128_fr
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