BZB100A NXP Semiconductors, BZB100A Datasheet - Page 3

• Manufacturer Part Number: BZB100A
• Description: Bidirectional Zener diode in a SOD323 (SC-76) very small Surface-MountedDevice (SMD) plastic package
• Manufacturer: NXP Semiconductors

NXP Semiconductors
6. Thermal characteristics
BZB100A_2
Product data sheet
Table 6.
[1]
[2]
[3]
[4]
Symbol
Per device
R
R
Fig 1.
th(j-a)
th(j-sp)
Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm
Device mounted on a ceramic PCB, Al
Soldering point of cathode tab.
(1) Ceramic PCB, Al
(2) FR4 PCB, mounting pad for cathode 1 cm
(3) FR4 PCB, standard footprint
Power derating curves
Thermal characteristics
Parameter
thermal resistance from
junction to ambient
thermal resistance from
junction to solder point
P
(W)
tot
2
Rev. 02 — 24 June 2008
1.0
0.8
0.6
0.4
0.2
O
0
3
, standard footprint
75
(1)
(2)
(3)
25
2
O
3
, standard footprint.
Conditions
in free air
25
2
75
125
T
006aab042
amb
[1]
[2]
[3]
[4]
( C)
175
Min
-
-
-
-
Bidirectional Zener diode
Typ
-
-
-
-
BZB100A
© NXP B.V. 2008. All rights reserved.
Max
415
230
150
90
2
Unit
K/W
K/W
K/W
K/W
.
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