IP4359CX4 NXP Semiconductors, IP4359CX4 Datasheet - Page 7

• Manufacturer Part Number: IP4359CX4
• Description: The IP4359CX4 is a dual channel low capacitance ElectroStatic Discharge (ESD)protection device, providing protection to downstream components from ESD voltages ashigh as ±15 kV contact discharge and > ±15 kV air discharge according theI
• Manufacturer: NXP Semiconductors

NXP Semiconductors
8. Design and assembly recommendations
IP4359CX4
Product data sheet
8.1 PCB design guidelines
8.2 PCB assembly guidelines for Pb-free soldering
Table 6.
For optimum performance it is recommended to use a Non-Solder Mask Defined (NSMD),
also known as a copper-defined design, incorporating laser-drilled micro-vias connecting
the ground pads to a buried ground-plane layer. This results in the lowest possible ground
inductance and provides the best high frequency and ESD performance. For this case,
refer to
Table 7.
Table 8.
Symbol
A
A
A
b
D
E
e
Parameter
PCB pad diameter
Micro-via diameter
Solder mask aperture diameter
Copper thickness
Copper finish
PCB material
Parameter
Solder screen aperture diameter
Solder screen thickness
Solder paste: Pb-free
Solder / flux ratio
Solder reflow profile
1
2
Table 7
Dimensions of IP4359CX4/LF-H500 for
Recommended PCB design parameters
Assembly recommendations
All information provided in this document is subject to legal disclaimers.
for the recommended PCB design parameters.
Min
0.41
0.18
0.23
0.21
0.71
0.71
-
Rev. 1 — 6 August 2010
Typ
0.45
0.20
0.25
0.26
0.76
0.76
0.4
Dual channel low capacitance ESD protection
Value or specification
250 μm
100 μm (0.004 inch)
325 μm
20 μm to 40 μm
AuNi or OSP
FR4
Value or specification
290 μm
100 μm (0.004 inch)
SnAg (3 % to 4 %) Cu (0.5 % to 0.9 %)
50 / 50
see
Figure 5
Figure 6
Max
0.49
0.22
0.27
0.31
0.81
0.81
-
IP4359CX4
© NXP B.V. 2010. All rights reserved.
Unit
mm
mm
mm
mm
mm
mm
mm
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