NUP1301U NXP Semiconductors, NUP1301U Datasheet - Page 4

• Manufacturer Part Number: NUP1301U
• Description: Ultra low capacitance ElectroStatic Discharge (ESD) protection array in a smallSOT323 (SC-70) Surface-Mounted Device (SMD) plastic package designed toprotect one signal line in rail-to-rail configuration from the damage caused byESD and other transie
• Manufacturer: NXP Semiconductors

NXP Semiconductors
6. Thermal characteristics
NUP1301U
Product data sheet
Fig 1.
(%)
I
PP
120
80
40
0
0
IEC 61000-4-5
8/20 s pulse waveform according to
10
100 % I
Table 8.
[1]
[2]
Symbol
R
Per device
R
e
th(j-a)
th(j-sp)
−t
PP
Single diode loaded.
Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
20
; 8 μs
50 % I
Parameter
thermal resistance from
junction to ambient
thermal resistance from
junction to solder point
Thermal characteristics
30
PP
; 20 μs
All information provided in this document is subject to legal disclaimers.
001aaa630
t (μs)
Rev. 1 — 28 January 2011
40
Fig 2.
Conditions
in free air
100 %
90 %
10 %
ESD pulse waveform according to
IEC 61000-4-2
I
Ultra low capacitance ESD protection array
PP
t
r
30 ns
= 0.7 ns to 1 ns
[1][2]
Min
-
-
60 ns
NUP1301U
Typ
-
-
© NXP B.V. 2011. All rights reserved.
Max
625
300
001aaa631
t
Unit
K/W
K/W
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