IP4085_4385_4386_4387_CX4 NXP Semiconductors, IP4085_4385_4386_4387_CX4 Datasheet

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IP4085_4385_4386_4387_CX4

Manufacturer Part Number
IP4085_4385_4386_4387_CX4
Description
Manufacturer
NXP Semiconductors
Datasheet
1.IP4085_4385_4386_4387_CX4.pdf (16 pages)
1. Product profile
1.1 General description
1.2 Features
1.3 Applications
IP4085CX4, IP4385CX4, IP4386CX4 and IP4387CX4 are designed to protect appliances
from destruction by either:
Each device has a single high-performance ESD-protection diode with the anode and
cathode each connected to two solder balls. The IP4085CX4, IP4385CX4, IP4386CX4
and IP4387CX4 are fabricated using monolithic silicon technology in a Wafer-Level
Chip-Scale Package (WLCSP) with a pitch of 0.4 mm (IP438xCX4) or 0.5 mm
(IP4085CX4).
I
I
I
I
I
I
•
•
•
IP4085CX4; IP4385CX4;
IP4386CX4; IP4387CX4
Integrated high-performance ESD-protection diodes to
IEC61000-4-2, level 4
Rev. 01 — 26 March 2009
Pb-free, RoHS and Dark Green compliant
Single integrated high-performance ESD-protection diode
Surge immunity according to IEC 61000-4-5 (8/20 s) up to 60 A (IP4085CX4)
ESD protection of >30 kV contact discharge, far exceeding IEC 61000-4-2 standard,
level 4
Small 2
General purpose ESD-protection such as for charger interfaces in:
ElectroStatic Discharges (ESD) of 30 kV, far exceeding IEC 61000-4-2 standard,
level 4
overvoltage
wrong polarity
N
N
N
Cellular and PCS mobile handsets
Cordless telephones
Wireless data (WAN/LAN) systems
2 solder ball WLCSP package with 0.4 mm or 0.5 mm pitch
Product data sheet

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IP4085_4385_4386_4387_CX4 Summary of contents

Page 1

IP4085CX4; IP4385CX4; IP4386CX4; IP4387CX4 Integrated high-performance ESD-protection diodes to IEC61000-4-2, level 4 Rev. 01 — 26 March 2009 1. Product profile 1.1 General description IP4085CX4, IP4385CX4, IP4386CX4 and IP4387CX4 are designed to protect appliances from destruction by either: • ElectroStatic ...

Page 2

... IP4386CX4/LF WLCSP4 wafer level chip-size package: 4 bumps; 0.76 IP4387CX4/LF WLCSP4 wafer level chip-size package: 4 bumps; 0.76 4. Functional diagram Fig 2. IP4085_4385_4386_4387_CX4_1 Product data sheet IP4085/4385/4386/4387/CX4 Integrated high-performance ESD-protection diodes ball A1 index area A B Pin configuration IP4085CX4; IP4385CX4; IP4386CX4; IP4387CX4 ...

Page 3

... CC V electrostatic discharge voltage ESD I peak pulse current PP I non-repetitive peak forward FSM current P total power dissipation tot IP4085_4385_4386_4387_CX4_1 Product data sheet IP4085/4385/4386/4387/CX4 Integrated high-performance ESD-protection diodes Conditions IP4085CX4/LF; IP4386CX4/LF IP4385CX4/LF IP4387CX4/LF all pins to ground [1] contact discharge [1] air discharge IEC 61000-4-2, level 4; ...

Page 4

... Parameter V breakdown voltage BR V transient clamping voltage CL(trt) I reverse leakage current LR IP4085CX4; IP4385CX4 IP4386CX4 IP4387CX4 IP4085_4385_4386_4387_CX4_1 Product data sheet IP4085/4385/4386/4387/CX4 Integrated high-performance ESD-protection diodes Conditions 10 s maximum to be 130 K/W as specifi Thermal characteristics Parameter thermal resistance from junction to ambient Conditions ...

Page 5

... IP4386CX4 IP4387CX4 8. Application information 8.1 Forward current DC clamping voltage The forward current DC clamping voltage is of interest when protecting circuits from voltage sources with the wrong polarity. Fig 3. IP4085_4385_4386_4387_CX4_1 Product data sheet IP4085/4385/4386/4387/CX4 Integrated high-performance ESD-protection diodes …continued Conditions DC bias MHz ...

Page 6

... DC clamping voltage as a function of forward current; IP4085CX4 1 (V) 1.0 0.9 0.8 0.7 0 0.2 0.4 ( +25 C. amb ( +85 C. amb ( amb Fig 6. DC clamping voltage as a function of forward current; IP4386CX4 IP4085_4385_4386_4387_CX4_1 Product data sheet IP4085/4385/4386/4387/CX4 Integrated high-performance ESD-protection diodes 001aaj241 V (1) (2) (3) 0.6 0.8 1.0 I (A) F Fig 5. 001aaj243 V (1) (2) (3) 0.6 0.8 1.0 I ...

Page 7

... The current pulse shape over time is shown in measurement setup for forward current and reverse current pulses respectively are shown in Figure 8 Fig 8. Fig 9. IP4085_4385_4386_4387_CX4_1 Product data sheet IP4085/4385/4386/4387/CX4 Integrated high-performance ESD-protection diodes and Figure 14. ...

Page 8

... IP4085CX4 20 V CL( +25 C. amb ( +85 C. amb ( amb Fig 12. Peak clamping voltage as a function of forward current; IP4386CX4 IP4085_4385_4386_4387_CX4_1 Product data sheet IP4085/4385/4386/4387/CX4 Integrated high-performance ESD-protection diodes 001aaj247 20 V CL(M) (V) 16 (3) ( (A) F (1) T (2) T (3) T Fig 11 ...

Page 9

... V CL(M) (V) 18 (1) 17 (3) 16 0.2 0.4 0.6 0.8 1.0 ( +25 C. amb ( +85 C. amb ( amb Fig 15. Peak clamping voltage as a function of reverse current; IP4085CX4 IP4085_4385_4386_4387_CX4_1 Product data sheet IP4085/4385/4386/4387/CX4 Integrated high-performance ESD-protection diodes I PP 001aaj251 8.75 V CL(M) (V) 8.50 8.25 8.00 7.75 7.50 1.2 1.4 1.6 0.4 I (A) R (1) T (2) T (3) T Fig 16. Peak clamping voltage as a function of reverse Rev. 01 — ...

Page 10

... Fig 17. Peak clamping voltage as a function of reverse current; IP4386CX4 Remark: Measurements done on a heat-dissipation optimized PCB with massive copper area under the DUT. 9. Marking Fig 19. Marking of IP4085CX4, IP4385CX4, IP4386CX4 and IP4387CX4 IP4085_4385_4386_4387_CX4_1 Product data sheet IP4085/4385/4386/4387/CX4 Integrated high-performance ESD-protection diodes 001aaj253 12.2 ...

Page 11

... Dimensions Unit max 0.70 0.26 0.37 0.96 mm nom 0.65 0.24 0.32 0.91 min 0.60 0.22 0.27 0.86 Outline version IEC IP4085CX4/LF Fig 20. Package outline IP4085CX4/LF (WLCSP4) IP4085_4385_4386_4387_CX4_1 Product data sheet IP4085/4385/4386/4387/CX4 Integrated high-performance ESD-protection diodes 0.5 scale 0.96 0.91 0.5 0.005 0.02 0.86 References JEDEC JEITA Rev. 01 — 26 March 2009 ...

Page 12

... Dimensions Unit max 0.66 0.22 0.31 0.81 mm nom 0.61 0.20 0.26 0.76 min 0.56 0.18 0.21 0.71 Outline version IEC IP438xCX4/LF Fig 21. Package outline IP438xCX4/LF (WLCSP4) IP4085_4385_4386_4387_CX4_1 Product data sheet IP4085/4385/4386/4387/CX4 Integrated high-performance ESD-protection diodes 0.25 scale 0.81 0.76 0.4 0.005 0.02 0.71 References JEDEC JEITA Rev. 01 — 26 March 2009 ...

Page 13

... Solder screen aperture diameter Solder screen thickness Solder paste: Pb-free Solder/flux ratio Solder reflow profile Fig 22. Pb-free solder reflow profile IP4085_4385_4386_4387_CX4_1 Product data sheet IP4085/4385/4386/4387/CX4 Integrated high-performance ESD-protection diodes Table 6 for the recommended PCB design parameters. Recommended PCB design parameters ...

Page 14

... DUT FR4 LAN PCB PCS RoHS WAN WLCSP 13. Revision history Table 10. Revision history Document ID IP4085_4385_4386_4387_CX4_1 IP4085_4385_4386_4387_CX4_1 Product data sheet IP4085/4385/4386/4387/CX4 Integrated high-performance ESD-protection diodes Reflow soldering process characteristics Parameter Conditions peak reflow temperature time 1 soak time time 2 time during T time 3 time during T time 4 time during T > ...

Page 15

... NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental 15. Contact information For more information, please visit: For sales office addresses, please send an email to: IP4085_4385_4386_4387_CX4_1 Product data sheet IP4085/4385/4386/4387/CX4 Integrated high-performance ESD-protection diodes [3] Definition This document contains data from the objective specifi ...

Page 16

... Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2009. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Document identifier: IP4085_4385_4386_4387_CX4_1 All rights reserved. Date of release: 26 March 2009 ...

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