PESD1CAN NXP Semiconductors, PESD1CAN Datasheet - Page 9

• Manufacturer Part Number: PESD1CAN
• Description: PESD1CAN in a small SOT23 (TO-236AB) Surface-Mounted Device (SMD) plasticpackage designed to protect two automotive Controller Area Network (CAN) bus linesfrom the damage caused by ElectroStatic Discharge (ESD) and other transients
• Manufacturer: NXP Semiconductors

NXP Semiconductors
10. Soldering
PESD1CAN_4
Product data sheet
Fig 10. Reflow soldering footprint SOT23 (TO-236AB)
Fig 11. Wave soldering footprint SOT23 (TO-236AB)
4.60
3.00
4.00
0.85
0.85
1.20
1.30
Rev. 04 — 15 February 2008
2
2
3.40
2.80
4.50
2.90
2.50
1.00
3.30
3
3
1.20 (2x)
0.50 (3x)
1
0.60 (3x)
1
0.60
(3x)
Dimensions in mm
preferred transport direction during soldering
sot023
2.70
CAN bus ESD protection diode
solder lands
solder resist
occupied area
Dimensions in mm
PESD1CAN
solder lands
solder resist
solder paste
occupied area
© NXP B.V. 2008. All rights reserved.
sot023
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