LPC11U24FBD64 NXP Semiconductors, LPC11U24FBD64 Datasheet - Page 3

The LPC11U24FBD64 is a ARM Cortex-M0 based, low-cost 32-bit MCU, designed for 8/16-bit microcontroller applications, offering performance, low power, simple instruction set and memory addressing together with reduced code size compared to existing 8/

LPC11U24FBD64

Manufacturer Part Number
LPC11U24FBD64
Description
The LPC11U24FBD64 is a ARM Cortex-M0 based, low-cost 32-bit MCU, designed for 8/16-bit microcontroller applications, offering performance, low power, simple instruction set and memory addressing together with reduced code size compared to existing 8/
Manufacturer
NXP Semiconductors
Datasheet

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NXP Semiconductors
3. Applications
4. Ordering information
Table 1.
Table 2.
LPC11U2X
Product data sheet
Type number
LPC11U23FBD48/301
LPC11U24FHI33/301
LPC11U24FBD48/301
LPC11U24FET48/301
LPC11U24FHN33/401 HVQFN33
LPC11U24FBD48/401
LPC11U24FBD64/401
Part Number
LPC11U23FBD48/301 24
LPC11U24FHI33/301
LPC11U24FBD48/301 32
LPC11U24FET48/301
LPC11U24FHN33/401 32
LPC11U24FBD48/401 32
LPC11U24FBD64/401 32
Ordering information
Part ordering options
4.1 Ordering options
Flash
(kB)
32
32
Package
Name
LQFP48
HVQFN33
LQFP48
TFBGA48
LQFP48
LQFP64
Unique device serial number for identification.
Single 3.3 V power supply (1.8 V to 3.6 V).
Temperature range 40 C to +85 C.
Available as LQFP64, LQFP48, TFBGA48, and HVQFN33 packages.
Consumer peripherals
Medical
Industrial control
EEPROM
(kB)
1
2
2
2
4
4
4
Description
plastic low profile quad flat package; 48 leads; body 7  7  1.4 mm
plastic thermal enhanced very thin quad flat package; no leads; 33
terminals; body 5  5  0.85 mm
plastic low profile quad flat package; 48 leads; body 7  7  1.4 mm
plastic thin fine-pitch ball grid array package; 48 balls; body 4.5  4.5 
0.7 mm
plastic thermal enhanced very thin quad flat package; no leads; 33
terminals; body 7  7  0.85 mm
plastic low profile quad flat package; 48 leads; body 7  7  1.4 mm
plastic low profile quad flat package; 64 leads; body 10  10  1.4 mm
All information provided in this document is subject to legal disclaimers.
Main
SRAM
(kB)
6
6
6
6
8
8
8
Rev. 2 — 13 January 2012
USB
SRAM
(kB)
2
2
2
2
2
2
2
USB I
1
1
1
1
1
1
1
FM+
1
1
1
1
1
1
1
2
C-bus
SSP ADC
2
2
2
2
2
2
2
Handheld scanners
USB audio devices
32-bit ARM Cortex-M0 microcontroller
8
8
8
8
8
channels
8
8
GPIO Package
40
26
40
40
26
40
54
LPC11U2x
LQFP48
HVQFN33 (5  5 )
LQFP48
TFBGA48
HVQFN33 (7  7)
LQFP48
LQFP64
© NXP B.V. 2012. All rights reserved.
Version
SOT313-2
n/a
SOT313-2
SOT1155-2
SOT314-2
n/a
SOT313-2
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