BLF8G10LS-160 NXP Semiconductors, BLF8G10LS-160 Datasheet

160 W LDMOS power transistor for base station applications at frequencies from 920 MHz to 960 MHz

BLF8G10LS-160

Manufacturer Part Number
BLF8G10LS-160
Description
160 W LDMOS power transistor for base station applications at frequencies from 920 MHz to 960 MHz
Manufacturer
NXP Semiconductors
Datasheet
1.BLF8G10L-160.pdf (13 pages)
1. Product profile
1.1 General description
1.2 Features and benefits
1.3 Applications
160 W LDMOS power transistor for base station applications at frequencies from
920 MHz to 960 MHz.
Table 1.
Typical RF performance at T
[1]
Test signal
2-carrier W-CDMA
BLF8G10L-160;
BLF8G10LS-160
Power LDMOS transistor
Rev. 3 — 16 February 2012
Excellent ruggedness
High efficiency
Low R
Designed for broadband operation (920 MHz to 960 MHz)
Lower output capacitance for improved performance in Doherty applications
Designed for low memory effects providing excellent pre-distortability
Internally matched for ease of use
Integrated ESD protection
Compliant to Directive 2002/95/EC, regarding Restriction of Hazardous Substances
(RoHS)
RF power amplifiers for W-CDMA base stations and multi carrier applications in the
920 MHz to 960 MHz frequency range
Test signal: 3GPP; test model 1; 64 DPCH; PAR = 7.5 dB at 0.01 % probability on CCDF per carrier.
Carrier spacing 5 MHz.
th
Typical performance
providing excellent thermal stability
case
f
(MHz)
920 to 960
= 25
C in a common source class-AB production test circuit.
I
(mA)
1100
Dq
V
(V)
30
DS
P
(W)
35
L(AV)
G
(dB)
19.7
Product data sheet
p
(%)
29
D
ACPR
(dBc)
38
[1]

Related parts for BLF8G10LS-160

Image
Part Number
Description
Manufacturer
Datasheet
Request R
BLF8G10L-160
Part Number:
BLF8G10L-160
Description:
160 W LDMOS power transistor for base station applications at frequencies from 920 MHz to 960 MHz
Manufacturer:
NXP Semiconductors
Datasheet:
BLF8G10L-160.pdf (13 pages)
LPC2420_60
Part Number:
LPC2420_60
Description:
NXP Semiconductors designed the LPC2420/2460 microcontroller around a 16-bit/32-bitARM7TDMI-S CPU core with real-time debug interfaces that include both JTAG andembedded trace
Manufacturer:
NXP Semiconductors
Datasheet:
LPC2420_60.pdf (86 pages)
LPC2458
Part Number:
LPC2458
Description:
NXP Semiconductors designed the LPC2458 microcontroller around a 16-bit/32-bitARM7TDMI-S CPU core with real-time debug interfaces that include both JTAG andembedded trace
Manufacturer:
NXP Semiconductors
Datasheet:
LPC2458.pdf (80 pages)
LPC2468
Part Number:
LPC2468
Description:
NXP Semiconductors designed the LPC2468 microcontroller around a 16-bit/32-bitARM7TDMI-S CPU core with real-time debug interfaces that include both JTAG andembedded trace
Manufacturer:
NXP Semiconductors
Datasheet:
LPC2468.pdf (85 pages)
LPC2470
Part Number:
LPC2470
Description:
NXP Semiconductors designed the LPC2470 microcontroller, powered by theARM7TDMI-S core, to be a highly integrated microcontroller for a wide range ofapplications that require advanced communications and high quality graphic displays
Manufacturer:
NXP Semiconductors
Datasheet:
LPC2470.pdf (91 pages)
LPC2478
Part Number:
LPC2478
Description:
NXP Semiconductors designed the LPC2478 microcontroller, powered by theARM7TDMI-S core, to be a highly integrated microcontroller for a wide range ofapplications that require advanced communications and high quality graphic displays
Manufacturer:
NXP Semiconductors
Datasheet:
LPC2478.pdf (93 pages)
XA-G30
Part Number:
XA-G30
Description:
The Philips Semiconductors XA (eXtended Architecture) family of 16-bit single-chip microcontrollers is powerful enough to easily handle the requirements of high performance embedded applications, yet inexpensive enough to compete in the market for hi
Manufacturer:
NXP Semiconductors
Datasheet:
XA-G30.pdf (36 pages)
XA-G37
Part Number:
XA-G37
Description:
The Philips Semiconductors XA (eXtended Architecture) family of 16-bit single-chip microcontrollers is powerful enough to easily handle the requirements of high performance embedded applications, yet inexpensive enough to compete in the market for hi
Manufacturer:
NXP Semiconductors
Datasheet:
XA-G37.pdf (37 pages)
XA-S3
Part Number:
XA-S3
Description:
The XA-S3 device is a member of Philips Semiconductors? XA(eXtended Architecture) family of high performance 16-bitsingle-chip microcontrollers
Manufacturer:
NXP Semiconductors
Datasheet:
XA-S3.pdf (52 pages)
LH75401_LH75411_N
Part Number:
LH75401_LH75411_N
Description:
The NXP BlueStreak LH75401/LH75411 family consists of two low-cost 16/32-bit System-on-Chip (SoC) devices
Manufacturer:
NXP Semiconductors
Datasheet:
LH75401_LH75411_N.pdf (63 pages)
LPC3130_3131
Part Number:
LPC3130_3131
Description:
The NXP LPC3130/3131 combine an 180 MHz ARM926EJ-S CPU core, high-speed USB2
Manufacturer:
NXP Semiconductors
Datasheet:
LPC3130_3131.pdf (68 pages)
LPC3141FET180
Part Number:
LPC3141FET180
Description:
The NXP LPC3141 combine a 270 MHz ARM926EJ-S CPU core, High-speed USB 2
Manufacturer:
NXP Semiconductors
LPC3143FET180
Part Number:
LPC3143FET180
Description:
The NXP LPC3143 combine a 270 MHz ARM926EJ-S CPU core, High-speed USB 2
Manufacturer:
NXP Semiconductors
LPC3152FET208
Part Number:
LPC3152FET208
Description:
The NXP LPC3152 combines an 180 MHz ARM926EJ-S CPU core, High-speed USB 2
Manufacturer:
NXP Semiconductors
LPC3154FET208
Part Number:
LPC3154FET208
Description:
The NXP LPC3154 combines an 180 MHz ARM926EJ-S CPU core, High-speed USB 2
Manufacturer:
NXP Semiconductors

BLF8G10LS-160 Summary of contents

Page 1

... BLF8G10L-160; BLF8G10LS-160 Power LDMOS transistor Rev. 3 — 16 February 2012 1. Product profile 1.1 General description 160 W LDMOS power transistor for base station applications at frequencies from 920 MHz to 960 MHz. Table 1. Typical RF performance at T Test signal 2-carrier W-CDMA [1] Test signal: 3GPP; test model 1; 64 DPCH; PAR = 7 0.01 % probability on CCDF per carrier. ...

Page 2

... NXP Semiconductors 2. Pinning information Table 2. Pin BLF8G10L-160 (SOT502A BLF8G10LS-160 (SOT502B [1] Connected to flange 3. Ordering information Table 3. Type number BLF8G10L-160 BLF8G10LS-160 4. Limiting values Table 4. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol stg Thermal characteristics Table 5 ...

Page 3

... Symbol  D ACPR 7.1 Ruggedness in class-AB operation The BLF8G10L-160 and BLF8G10LS-160 are capable of withstanding a load mismatch corresponding to VSWR = through all phases under the following conditions BLF8G10L-160_8G10LS-160 Product data sheet BLF8G10L-160; BLF8G10LS-160 Characteristics C unless otherwise specified. ...

Page 4

... 1100 mA ( 920 MHz ( 940 MHz ( 960 MHz Fig 2. Power gain and drain efficiency as function of output power; typical values BLF8G10L-160_8G10LS-160 Product data sheet BLF8G10L-160; BLF8G10LS-160 Typical impedance information = defined in Figure () 4.0  j3.8 4.4  j4.2 4.6  ...

Page 5

... 1100 mA ( 920 MHz ( 940 MHz ( 960 MHz Fig 5. Power gain and drain efficiency as function of output power; typical values BLF8G10L-160_8G10LS-160 Product data sheet BLF8G10L-160; BLF8G10LS-160 - (dB) -13 (3) -16 (2) -19 (1) -22 - aaa-001290 60 η ...

Page 6

... 1100 mA ( 920 MHz ( 940 MHz ( 960 MHz Fig 9. Peak-to-average ratio as a function of output power; typical values BLF8G10L-160_8G10LS-160 Product data sheet BLF8G10L-160; BLF8G10LS-160 aaa-001292 ACPR (dBc (dBm 920 MHz ( 940 MHz ( 960 MHz Fig 8 ...

Page 7

... Figure 10 Component C1, C2, C3, C4, C5, C6 C7, C9, C12, C14 C8, C10, C11, C13 C15, C16 BLF8G10L-160_8G10LS-160 Product data sheet BLF8G10L-160; BLF8G10LS-160 = 3.5 F/m; thickness = 0.762 mm; thickness copper plating = 35 m. r List of components for component layout. Description multilayer ceramic chip capacitor multilayer ceramic chip capacitor multilayer ceramic chip capacitor electrolytic capacitor All information provided in this document is subject to legal disclaimers ...

Page 8

... DIMENSIONS (millimetre dimensions are derived from the original inch dimensions) c UNIT 12.83 4.72 0.15 20.02 mm 12.57 3.43 0.08 19.61 0.505 0.186 0.006 0.788 inches 0.135 0.495 0.772 0.003 OUTLINE VERSION IEC SOT502A Fig 11. Package outline SOT502A BLF8G10L-160_8G10LS-160 Product data sheet BLF8G10L-160; BLF8G10LS-160 scale 19.96 9.50 9.53 1.14 19.94 5.33 19.66 9.30 9 ...

Page 9

... DIMENSIONS (millimetre dimensions are derived from the original inch dimensions) c UNIT 12.83 4.72 0.15 20.02 mm 12.57 3.43 0.08 19.61 0.186 0.505 0.788 0.006 inches 0.135 0.495 0.772 0.003 OUTLINE VERSION IEC SOT502B Fig 12. Package outline SOT502B BLF8G10L-160_8G10LS-160 Product data sheet BLF8G10L-160; BLF8G10LS-160 scale 19.96 9.50 9.53 1.14 19.94 5.33 19.66 9 ...

Page 10

... Table 11. Revision history Document ID BLF8G10L-160_8G10LS-160 v.3 Modifications: BLF8G10L-160_8G10LS-160 v.2 BLF8G10L-160_8G10LS-160 v.1 BLF8G10L-160_8G10LS-160 Product data sheet BLF8G10L-160; BLF8G10LS-160 Abbreviations Description Third Generation Partnership Project Complementary Cumulative Distribution Function Continuous Wave Dedicated Physical CHannel ElectroStatic Discharge Laterally Diffused Metal Oxide Semiconductor Laterally Diffused Metal Oxide Semiconductor Transistor ...

Page 11

... This document supersedes and replaces all information supplied prior to the publication hereof. BLF8G10L-160_8G10LS-160 Product data sheet BLF8G10L-160; BLF8G10LS-160 [3] Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. ...

Page 12

... For sales office addresses, please send an email to: BLF8G10L-160_8G10LS-160 Product data sheet BLF8G10L-160; BLF8G10LS-160 In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the ...

Page 13

... Trademarks Contact information Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 BLF8G10L-160; BLF8G10LS-160 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2012. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Power LDMOS transistor All rights reserved ...

Related keywords