STPS160 STMicroelectronics, STPS160 Datasheet

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STPS160

Manufacturer Part Number
STPS160
Description
Power Schottky Rectifier
Manufacturer
STMicroelectronics
Datasheet

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Features
Description
Single chip Schottky rectifiers suited to switched
mode power supplies and high frequency DC to
DC converters.
Packaged in SMA and SMB, this device is
especially intended for surface mounting and
used in low voltage, high frequency inverters, free
wheeling and polarity protection applications.
March 2010
Very small conduction losses
Negligible switching losses
Low forward voltage drop
Surface mount miniature packages
Avalanche capability specified
Doc ID 4608 Rev 9
Table 1.
(JEDEC DO-214AC)
K
STPS160A
Symbol
V
T
V
I
SMA
F (max)
j (max)
F(AV)
RRM
Device summary
Power Schottky rectifier
A
(JEDEC DO-214AA)
STPS160
K
STPS160U
150 °C
0.57 V
Value
60 V
SMB
1 A
www.st.com
A
1/9
9

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STPS160 Summary of contents

Page 1

... March 2010 Power Schottky rectifier A K SMA (JEDEC DO-214AC) STPS160A Table 1. Device summary Symbol I F(AV) V RRM T j (max (max) Doc ID 4608 Rev 9 STPS160 A K SMB (JEDEC DO-214AA) STPS160U Value 150 °C 0.57 V 1/9 www.st.com 9 ...

Page 2

... F (RMS) Doc ID 4608 Rev 9 Value 60 δ = 0.5 = 130 ° °C 2400 150 (1) 150 10000 Value SMA 30 SMB 23 Min. Typ. Max RRM 1.1 0. 0.49 0. 0.58 0.65 STPS160 Unit °C °C V/µs Unit °C/W Unit 4 µ 0.8 ...

Page 3

... STPS160 Figure 1. Average forward power dissipation versus average forward current P (W) F(AV) 0.7 δ = 0.2 δ = 0.1 δ = 0.05 0.6 0.5 0.4 0.3 0.2 0.1 I (A) F(AV) 0.0 0.0 0.2 0.4 0.6 Figure 3. Normalized avalanche power derating versus pulse duration ARM p P (1µs) ARM 1 0.1 0.01 t (µs) p 0.001 0.01 0.1 1 Figure 5. Non repetitive surge peak forward current versus overload duration ...

Page 4

... V ( ambient versus copper surface under each lead (SMA) (°C/W) Epoxy printed circuit board Fr4 copper thickness: 35 µm S(Cu)(cm² STPS160 T tp 1E+3 F=1MHz T =25° 100 5 ...

Page 5

... STPS160 Figure 13. Thermal resistance junction to ambient versus copper surface under each lead (Epoxy printed circuit board FR4, copper thickness: 35 µm) (SMB) R (°C/W) th(j-a) 100 S(Cu)(cm² Doc ID 4608 Rev 9 Characteristics 4 5 5/9 ...

Page 6

... ECOPACK trademark. Table 5. SMA dimensions Figure 14. Footprint, dimensions in mm (inches) 6/9 Ref 2.63 1.4 (0.055) (0.103) 5.43 (0.214) Doc ID 4608 Rev 9 STPS160 Dimensions Millimeters Inches Min. Max. Min. 1.90 2.45 0.075 0.05 0.20 0.002 1.25 1.65 0.049 0.15 0.40 0.006 2.25 2.90 0.089 4.80 5.35 0.189 3.95 4.60 0.156 0.75 1.50 0.030 1 ...

Page 7

... STPS160 Table 6. SMB dimensions Figure 15. Footprint, dimensions in mm (inches) Ref 1.62 2.60 1.62 (0.064) (0.102) (0.064) 5.84 (0.300) Doc ID 4608 Rev 9 Package information Dimensions Millimeters Inches Min. Max. Min. Max. 1.90 2.45 0.075 0.096 0.05 0.20 0.002 0.008 1.95 2.20 0.077 0.087 0.15 0.40 0.006 0.016 3 ...

Page 8

... SMA package dimensions update. Reference A1 max changed 7 from 2.70 mm (0.106 inc.) to 2.03 mm (0.080 inc). Reformatted to current standards Package dimensions and footprints updated. Ecopack statement added. 9 Updated package illustration Doc ID 4608 Rev 9 STPS160 Weight Base qty Delivery mode 0.068 g 5000 Tape and reel 0.107 g 2500 Tape and reel ...

Page 9

... STPS160 Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. ...

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