STPS160 STMicroelectronics, STPS160 Datasheet - Page 4

• Manufacturer Part Number: STPS160
• Description: Power Schottky Rectifier
• Manufacturer: STMicroelectronics

Characteristics
4/9
Figure 7.
Figure 9.
Figure 11. Forward voltage drop versus
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.0
1E+3
1E+2
1E+0
1E+0
0.1
1E+1
1E+1
1E-2
1E-1
1E-1
1E-2
Z
δ = 0.5
δ = 0.2
Single pulse
0
0
δ = 0.1
th(j-c)
I (µA)
I
epoxy printed circuit board, e
R
FM
(A)
5
/R
recommended pad layout
0.2
th(j-c)
10
Relative variation of thermal
impedance junction to ambient
versus pulse duration (SMA)
Reverse leakage current versus
reverse voltage applied
(typical values)
forward current (maximum values)
1E-1
0.4
15
T =125°C
j
20
0.6
(Cu)
25
V
= 35 µm
FM
1E+0
t (s)
T =105°C
T =25°C
V (V)
p
T =75°C
j
j
j
0.8
R
(V)
30
T =25°C
j
35
1
40
1E+1
1.2
δ
45
=tp/T
50
T
1.4
Doc ID 4608 Rev 9
55
tp
1E+2
1.6
60
Figure 8.
Figure 10. Junction capacitance versus
Figure 12. Thermal resistance junction to
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
200
100
140
120
100
50
20
10
80
60
40
20
0
1E-2
0
R
Z
1
C(pF)
δ = 0.5
δ = 0.2
Single pulse
δ = 0.1
th(j-c)
th(j-a)
epoxy printed circuit board, e
/R
(°C/W)
recommended pad layout
th(j-c)
2
1E-1
Relative variation of thermal
impedance junction to ambient
versus pulse duration (SMB)
reverse voltage applied
(typical values)
ambient versus copper surface
under each lead (SMA)
1
5
1E+0
S(Cu)(cm²)
(Cu)
2
= 35 µm
t (s)
V (V)
p
R
10
1E+1
Epoxy printed circuit board Fr4
3
copper thickness: 35 µm
20
δ
1E+2
=tp/T
4
50
T
STPS160
F=1MHz
T =25°C
j
tp
1E+3
100
5