74LVC1G07GW,125 NXP Semiconductors, 74LVC1G07GW,125 Datasheet - Page 8

IC BUFF OPEN DRAIN N-INV 5TSSOP

74LVC1G07GW,125

Manufacturer Part Number
74LVC1G07GW,125
Description
IC BUFF OPEN DRAIN N-INV 5TSSOP
Manufacturer
NXP Semiconductors
Series
74LVCr
Datasheet

Specifications of 74LVC1G07GW,125

Logic Type
Buffer/Line Driver, Non-Inverting with Open Drain
Package / Case
SC-70-5, SC-88A, SOT-323-5, SOT-353, 5-TSSOP
Number Of Elements
1
Number Of Bits Per Element
1
Current - Output High, Low
32mA, 32mA
Voltage - Supply
2 V ~ 5.5 V
Operating Temperature
-40°C ~ 125°C
Mounting Type
Surface Mount
Logic Family
74LVC
Number Of Channels Per Chip
1
Polarity
Non-Inverting
Supply Voltage (max)
5.5 V
Supply Voltage (min)
1.65 V
Maximum Operating Temperature
125 C
Mounting Style
SMD/SMT
Input Bias Current (max)
200 uA
Low Level Output Current
32 mA
Maximum Power Dissipation
250 mW
Minimum Operating Temperature
- 40 C
Number Of Lines (input / Output)
1 / 1
Output Type
Open Drain
Propagation Delay Time
4.5 ns
Logical Function
Buffer/Driver
Number Of Elements
1
Number Of Channels
1
Number Of Inputs
1
Number Of Outputs
1
Operating Supply Voltage (typ)
1.8/2.5/3.3/5V
Package Type
TSSOP
High Level Output Current
32mA
Operating Supply Voltage (max)
5.5V
Operating Supply Voltage (min)
1.65V
Quiescent Current
200uA
Technology
CMOS
Pin Count
5
Mounting
Surface Mount
Operating Temp Range
-40C to 125C
Operating Temperature Classification
Automotive
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
568-2295-2
74LVC1G07GW-G
935266681125

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
74LVC1G07GW,125
Manufacturer:
NXP Semiconductors
Quantity:
4 600
NXP Semiconductors
13. Package outline
Fig 9.
74LVC1G07
Product data sheet
TSSOP5: plastic thin shrink small outline package; 5 leads; body width 1.25 mm
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
UNIT
mm
Package outline SOT353-1 (TSSOP5)
OUTLINE
VERSION
SOT353-1
max.
1.1
A
0.1
A 1
0
1
5
1.0
0.8
A 2
y
IEC
e
Z
0.15
A 3
e 1
D
0.30
0.15
b p
0
b p
4
3
All information provided in this document is subject to legal disclaimers.
MO-203
0.25
0.08
JEDEC
c
w
REFERENCES
M
D
2.25
1.85
(1)
Rev. 9 — 24 August 2010
scale
1.5
1.35
1.15
E
(1)
SC-88A
JEITA
0.65
e
c
3 mm
e 1
1.3
A 2
A 1
2.25
H E
2.0
H E
E
0.425
detail X
L
0.46
0.21
L p
L
L p
A
Buffer with open-drain output
PROJECTION
EUROPEAN
(A 3 )
0.3
v
X
v
M
θ
74LVC1G07
0.1
w
A
A
0.1
© NXP B.V. 2010. All rights reserved.
y
ISSUE DATE
00-09-01
03-02-19
0.60
0.15
Z
(1)
SOT353-1
θ
8 of 17

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