74LVC245ABQ,115 NXP Semiconductors, 74LVC245ABQ,115 Datasheet - Page 2
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74LVC245ABQ,115
Manufacturer Part Number
74LVC245ABQ,115
Description
IC TRANSCVR TRI-ST 8BIT 20QFN
Manufacturer
NXP Semiconductors
Series
74LVCr
Datasheet
1.74LVC245APW118.pdf
(17 pages)
Specifications of 74LVC245ABQ,115
Logic Type
Transceiver, Non-Inverting
Package / Case
20-VQFN Exposed Pad, 20-HVQFN, 20-SQFN, 20-DHVQFN
Number Of Elements
1
Number Of Bits Per Element
8
Current - Output High, Low
24mA, 24mA
Voltage - Supply
2.7 V ~ 3.6 V
Operating Temperature
-40°C ~ 125°C
Mounting Type
Surface Mount
Logic Family
74LVC
Number Of Channels Per Chip
8
Input Level
LVTTL
Output Level
LVTTL
Output Type
3-State
High Level Output Current
- 24 mA
Low Level Output Current
24 mA
Propagation Delay Time
2.9 ns
Supply Voltage (max)
3.6 V
Supply Voltage (min)
1.2 V
Maximum Operating Temperature
+ 125 C
Function
Bus Transceiver
Input Bias Current (max)
40 uA
Maximum Power Dissipation
500 mW
Minimum Operating Temperature
- 40 C
Mounting Style
SMD/SMT
Polarity
Non-Inverting
Number Of Circuits
8
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
568-3012-2
935273595115
935273595115
NXP Semiconductors
3. Ordering information
Table 1.
4. Functional diagram
74LVC_LVCH245A_5
Product data sheet
Type number
74LVC245AD
74LVCH245AD
74LVC245ADB
74LVCH245ADB
74LVC245APW
74LVCH245APW
74LVC245ABQ
74LVCH245ABQ
74LVC245ABX
74LVCH245ABX
Fig 1.
Logic diagram
Ordering information
1
2
3
4
5
6
7
8
9
DIR
A0
A1
A2
A3
A4
A5
A6
A7
Package
Temperature range Name
40 C to +125 C
40 C to +125 C
40 C to +125 C
40 C to +125 C
40 C to +125 C
SO20
SSOP20
TSSOP20
DHVQFN20
DHXQFN20U
B0
B1
B2
B3
B4
B5
B6
B7
OE
mna174
19
18
17
16
15
14
13
12
11
Rev. 05 — 25 August 2009
Description
plastic small outline package; 20 leads;
body width 7.5 mm
plastic shrink small outline package; 20 leads;
body width 5.3 mm
plastic thin shrink small outline package; 20 leads;
body width 4.4 mm
plastic dual in-line compatible thermal enhanced
very thin quad flat package; no leads; 20 terminals;
body 2.5
plastic dual in-line compatible thermal enhanced
extremely thin quad flat package; no leads; 20
terminals; UTLP based; body 2.5 x 4.5 x 0.5 mm
74LVC245A; 74LVCH245A
Fig 2.
4.5
IEC logic symbol
0.85 mm
19
1
2
3
4
5
6
7
8
9
G3
3EN1
3EN2
Octal bus transceiver; 3-state
1
mna175
2
18
17
16
15
14
13
12
11
© NXP B.V. 2009. All rights reserved.
Version
SOT163-1
SOT339-1
SOT360-1
SOT764-1
SOT1045-1
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