TLE 8264-2E Infineon Technologies, TLE 8264-2E Datasheet - Page 92
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TLE 8264-2E
Manufacturer Part Number
TLE 8264-2E
Description
Manufacturer
Infineon Technologies
Datasheet
1.TLE_8264-2E.pdf
(94 pages)
Specifications of TLE 8264-2E
Packages
PG-DSO-36
Transceiver
High Speed CAN ISO 11898 - 5 / 3 x LIN2.0 / J2602
Voltage Regulator Output
2 x 200 mA + 400 mA
Watchdog
Standard and Window Watchdog
Quiescent Current (max.)
28 ?A (typ) Sleep Mode (5V on)
Standby Current
58 ?A (typ) Stop Mode (5V on)
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17
Figure 46
Note: For the SBC product family the package PG-DSO-36-38 with the leadframe A6901-C003 is used.
Green Product (RoHS compliant)
To meet the world-wide customer requirements for environmentally friendly products and to be compliant with
government regulations, the Universal System Basis Chip is available as a green product. Green products are
RoHS-Compliant (i.e Pb-free finish on leads and suitable for Pb-free soldering according to IPC/JEDEC J-STD-
020).
For information about packages and types of packing, refer to the
Infineon Internet Page “Products”: http://www.infineon.com/products.
Data Sheet
Package Outline
PG-DSO-36-38 (Leadframe A6901-003);)
Index Marking
Ejector Mark
Polish Finish
1) Does not include plastic or metal protrusion of 0.15 max. per side
2) Does not include dambar protrusion of 0.05 max. per side
3) Distance from leads bottom (= seating plane) to exposed diepad
4) Exclunding the mold flash allowance of 0.3mm MAX per side
Exposed Diepad Dimensions
Package
PG-DSO-36-24, -41, -42
PG-DSO-36-38
PG-DSO-36-38
PG-DSO-36-24
0.33
±0.08
17 x 0.65 = 11.05
36
2)
1
12.8
0.65
-0.2
0.17
1)
B
A
18
19
M
C
Leadframe
A6901-C001
A6901-C003
A6901-C007
A6901-C008 6.0 5.4
A-B
Ejector Mark
Cavity ID
4)
SEATING PLANE
C
D
0.1
36x
C
5.2
X
7
7
36x
92
5.1
5.1
4.6
Y
19
18
Bottom View
7.6
10.3
0.7
-0.2
0.35 x 45˚
X
±0.2
±0.3
1)
PG-DSO-36-24, -38, -41, -42-PO V08
36
1
D
Exposed Diepad
Index Marking
Rev. 1.0, 2009-03-31
Dimensions in mm
Package Outline
TLE8264-2E
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