HS1B Taiwan Semiconductor Company, Ltd. (TSC), HS1B Datasheet

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HS1B

Manufacturer Part Number
HS1B
Description
Manufacturer
Taiwan Semiconductor Company, Ltd. (TSC)
Datasheet

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Company:
Bonase Electronics (HK) Co., Limited Bonase Electronics (HK) Co., Limited
Part Number:
HS1B-0546RH-Q=5962D9569301VXC
Manufacturer:
INTERSIL
Quantity:
1 400
Price:
Company:
Bonase Electronics (HK) Co., Limited Bonase Electronics (HK) Co., Limited
Part Number:
HS1B-0548RH-Q
Manufacturer:
ZCOMM
Quantity:
1 400
Price:
Company:
Bonase Electronics (HK) Co., Limited Bonase Electronics (HK) Co., Limited
Part Number:
HS1B-0548RH-Q=5962D9569401VEC
Manufacturer:
ISL
Quantity:
1 400
Price:
Features
Mechanical Data
Maximum Ratings and Electrical Characteristics
Rating at 25
Single phase, half wave, 60 Hz, resistive or inductive load.
For capacitive load, derate current by 20%
Maximum Recurrent Peak Reverse Voltage
Maximum RMS Voltage
Maximum DC Blocking Voltage
Maximum Average Forward Rectified Current
See Fig.1
Peak Forward Surge Current, 8.3 ms Single
Half Sine-wave Superimposed on Rated
Load (JEDEC method )
Maximum Instantaneous Forward Voltage
@ 1.0A
Maximum DC Reverse Current @ T
at Rated DC Blocking Voltage @ T
Maximum Reverse Recovery Time ( Note 1)
Typical Junction Capacitance ( Note 2 )
Maximum Thermal Resistance (Note 3)
Operating Temperature Range
Storage Temperature Range
Notes:
Type Number
Glass passivated junction chip.
For surface mounted application
Low forward voltage drop
Low profile package
Built-in stain relief, ideal for automatic
placement
Fast switching for high efficiency
High temperature soldering:
260
Plastic material used carries Underwriters
Cases: Molded plastic
Terminals:
Polarity: Indicated by cathode band
Packing: 12mm tape per EIA STD RS-481
Weight: 0.064 gram
Laboratory Classification 94V0
o
C/10 seconds at terminals
1. Reverse Recovery Test Conditions: I
2. Measured at 1 MHz and Applied V
3. Mounted on P.C.Board with 0.2” x 0.2” (5mm x 5mm) Copper Pad Area.
o
C ambient temperature unless otherwise specified.
Pure tin plated, lead free
A
A
=125
=25
o
o
C
C
1.0 AMP. High Efficient Surface Mount Rectifiers
Symbol
V
V
R
T
I
V
I
R
FSM
Trr
(AV)
RRM
V
RMS
Cj
STG
I
θJA
T
=4.0 Volts.
DC
R
F
F
J
=0.5A, I
- 270 -
HS
1A
50
35
50
R
=1.0A, I
100
100
HS
1B
70
1.0
Dimensions in inches and (millimeters)
RR
200
140
200
HS
1D
50
20
=0.25A
-55 to +150
-55 to +150
300
210
300
SMA/DO-214AC
HS
1F
150
1.0
5.0
70
30
400
280
400
1.3
HS
1G
HS1A - HS1M
600
420
600
HS
1J
800 1000
560
800 1000
1.7
HS
1K
75
15
700
HS
1M
Version: B07
Units
o
C/W
uA
uA
nS
pF
o
o
V
V
V
A
A
V
C
C

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HS1B Summary of contents

Page 1

Features Glass passivated junction chip. For surface mounted application Low forward voltage drop Low profile package Built-in stain relief, ideal for automatic placement Fast switching for high efficiency High temperature soldering: o 260 C/10 seconds at terminals Plastic material used ...

Page 2

RATINGS AND CHARACTERISTIC CURVES (HS1A THRU HS1M) FIG.1- MAXIMUM AVERAGE FORWARD CURRENT DERATING 1.2 1.0 0.8 0.6 0.4 0 100 110 120 O LEAD TEMPERATURE FIG.3- MAXIMUM NON-REPETITIVE FORWARD SURGE CURRENT 8.3ms ...

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