74LVC3G34DP,125 NXP Semiconductors, 74LVC3G34DP,125 Datasheet - Page 2

IC BUFFER TRPL N-INVERT 8TSSOP

74LVC3G34DP,125

Manufacturer Part Number
74LVC3G34DP,125
Description
IC BUFFER TRPL N-INVERT 8TSSOP
Manufacturer
NXP Semiconductors
Series
74LVCr
Datasheet

Specifications of 74LVC3G34DP,125

Logic Type
Buffer/Line Driver, Non-Inverting
Package / Case
8-TSSOP
Number Of Elements
3
Number Of Bits Per Element
1
Current - Output High, Low
32mA, 32mA
Voltage - Supply
2 V ~ 5.5 V
Operating Temperature
-40°C ~ 125°C
Mounting Type
Surface Mount
Logic Family
74LVC
Number Of Channels Per Chip
3
Polarity
Non-Inverting
Supply Voltage (max)
5.5 V
Supply Voltage (min)
1.65 V
Maximum Operating Temperature
125 C
Mounting Style
SMD/SMT
High Level Output Current
- 32 mA
Input Bias Current (max)
40 uA
Low Level Output Current
32 mA
Maximum Power Dissipation
250 mW
Minimum Operating Temperature
- 40 C
Number Of Lines (input / Output)
3 / 3
Propagation Delay Time
4 ns
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
74LVC3G34DP-G
74LVC3G34DP-G
935275566125
NXP Semiconductors
3. Ordering information
Table 1.
4. Marking
Table 2.
[1]
74LVC3G34
Product data sheet
Type number
74LVC3G34DP
74LVC3G34DC
74LVC3G34GT
74LVC3G34GF
74LVC3G34GD
74LVC3G34GM
74LVC3G34GN
74LVC3G34GS
Type number
74LVC3G34DP
74LVC3G34DC
74LVC3G34GT
74LVC3G34GF
74LVC3G34GD
74LVC3G34GM
74LVC3G34GN
74LVC3G34GS
The pin 1 indicator is located on the lower left corner of the device, below the marking code.
Ordering information
Marking codes
Package
Temperature range Name
−40 °C to +125 °C
−40 °C to +125 °C
−40 °C to +125 °C
−40 °C to +125 °C
−40 °C to +125 °C
−40 °C to +125 °C
−40 °C to +125 °C
−40 °C to +125 °C
All information provided in this document is subject to legal disclaimers.
TSSOP8
VSSOP8 plastic very thin shrink small outline package; 8 leads;
XSON8
XSON8
XSON8U plastic extremely thin small outline package; no leads;
XQFN8U plastic extremely thin quad flat package; no leads;
XSON8
XSON8
Rev. 8 — 2 September 2010
Description
plastic thin shrink small outline package; 8 leads;
body width 3 mm; lead length 0.5 mm
body width 2.3 mm
plastic extremely thin small outline package; no leads;
8 terminals; body 1 × 1.95 × 0.5 mm
extremely thin small outline package; no leads;
8 terminals; body 1.35 × 1 × 0.5 mm
8 terminals; UTLP based; body 3 × 2 × 0.5 mm
8 terminals; UTLP based; body 1.6 × 1.6 × 0.5 mm
extremely thin small outline package; no leads;
8 terminals; body 1.2 × 1.0 × 0.35 mm
extremely thin small outline package; no leads;
8 terminals; body 1.35 × 1.0 × 0.35 mm
Marking code
V34
Y34
Y34
YA
Y34
Y34
YA
YA
[1]
74LVC3G34
© NXP B.V. 2010. All rights reserved.
Triple buffer
Version
SOT505-2
SOT765-1
SOT833-1
SOT1089
SOT996-2
SOT902-1
SOT1116
SOT1203
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