74ABT543AD,112 NXP Semiconductors, 74ABT543AD,112 Datasheet
![IC TRANSCVR TRI-ST 8BIT 24SOIC](/photos/6/52/65263/568-24-soic_sot137-1_sml.jpg)
74ABT543AD,112
Specifications of 74ABT543AD,112
74ABT543AD
935169490112
Related parts for 74ABT543AD,112
74ABT543AD,112 Summary of contents
Page 1
Octal latched transceiver with dual enable; 3-state Rev. 04 — 7 May 2010 1. General description The 74ABT543A high performance BiCMOS device combines low static and dynamic power dissipation with high speed and high output drive. The 74ABT543A octal ...
Page 2
... NXP Semiconductors 4. Functional diagram EAB 23 EBA 14 LEAB 1 LEBA Fig 1. Logic symbol OEBA EBA LEBA Fig 3. Logic diagram 74ABT543_4 Product data sheet Octal latched transceiver with dual enable; 3-state OEAB 13 OEBA 2 001aae900 Fig DETAIL DETAIL A × All information provided in this document is subject to legal disclaimers. ...
Page 3
... NXP Semiconductors 5. Pinning information 5.1 Pinning Fig 4. Pin configuration 5.2 Pin description Table 2. Pin description Symbol Pin LEBA 1 OEBA EAB 11 GND 12 OEAB 13 LEAB 22, 21, 20, 19, 18, 17, 16, 15 EBA 74ABT543_4 Product data sheet Octal latched transceiver with dual enable; 3-state 74ABT543A 1 LEBA ...
Page 4
... NXP Semiconductors 6. Functional description 6.1 Function table [1] Table 3. Function selection Input OEXX EXX ↑ [ HIGH voltage level HIGH voltage level one set-up time prior to the LOW-to-HIGH clock transition of LEXX or EXX ( BA LOW voltage level LOW voltage level one set-up time prior to the LOW-to-HIGH clock transition of LEXX or EXX ( BA); ...
Page 5
... NXP Semiconductors 7. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter V supply voltage CC V input voltage I V output voltage O I input clamping current IK I output clamping current OK I output current O T junction temperature j T storage temperature ...
Page 6
... NXP Semiconductors Table 6. Static characteristics Symbol Parameter I input leakage current I I power-off leakage OFF current I power-up/power-down O(pu/pd) output current I OFF-state output OZ current I output leakage current HIGH-state output current O I supply current CC ΔI additional supply CC current C input capacitance I C input/output I/O capacitance ...
Page 7
... NXP Semiconductors Table 7. Dynamic characteristics GND = 0 V; for test circuit, see Figure Symbol Parameter Conditions t OFF-state to LOW OEBA to An, OEAB to Bn; see PZL propagation delay EBA to An, EAB to Bn; see t HIGH to OFF-state OEBA to An, OEAB to Bn; see PHZ propagation delay EBA to An, EAB to Bn; see ...
Page 8
... NXP Semiconductors LEAB or LEBA and V are typical voltage output levels that occur with the output load Fig 6. Propagation delay latch enable (LEAB, LEBA) to output (An, Bn) OEAB, OEBA 1 typical voltage output level that occurs with the output load. OH Fig 7. Propagation delay 3-state output enable to HIGH-level and output disable from HIGH-level ...
Page 9
... NXP Semiconductors An, Bn LEAB, LEBA, EAB, EBA The shaded areas indicate when the input is permitted to change for predictable output performance. Fig 9. Data set-up and hold times and latch enable pulse width negative V M pulse positive V M pulse Input pulse definition ...
Page 10
... NXP Semiconductors 12. Package outline SO24: plastic small outline package; 24 leads; body width 7 pin 1 index 1 e DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT max. 0.3 2.45 mm 2.65 0.25 0.1 2.25 0.012 0.096 inches 0.1 0.01 0.004 0.089 Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. ...
Page 11
... NXP Semiconductors SSOP24: plastic shrink small outline package; 24 leads; body width 5 pin 1 index 1 DIMENSIONS (mm are the original dimensions) A UNIT max. 0.21 1. 0.25 0.05 1.65 Note 1. Plastic or metal protrusions of 0.2 mm maximum per side are not included. OUTLINE VERSION IEC SOT340-1 Fig 12. Package outline SOT340-1 (SSOP24) ...
Page 12
... NXP Semiconductors TSSOP24: plastic thin shrink small outline package; 24 leads; body width 4 pin 1 index 1 DIMENSIONS (mm are the original dimensions) A UNIT max. 0.15 0.95 mm 1.1 0.25 0.05 0.80 Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. ...
Page 13
... Modifications: The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • Legal texts have been adapted to the new company name where appropriate. • DIP 24 (SOT222-1) package removed from Section 3 “Ordering information” and Section 12 “ ...
Page 14
... In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or ...
Page 15
... NXP Semiconductors Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. 16. Contact information For more information, please visit: For sales office addresses, please send an email to: 74ABT543_4 Product data sheet Octal latched transceiver with dual enable ...
Page 16
... NXP Semiconductors 17. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 1 4 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 5 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 5.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 5.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 6 Functional description . . . . . . . . . . . . . . . . . . . 4 6.1 Function table . . . . . . . . . . . . . . . . . . . . . . . . . . 4 6.2 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 7 Limiting values Recommended operating conditions Static characteristics Dynamic characteristics . . . . . . . . . . . . . . . . . . 6 11 Waveforms ...