CMS17 TOSHIBA Semiconductor CORPORATION, CMS17 Datasheet
CMS17
Manufacturer Part Number
CMS17
Description
Toshiba Schottky Barrier Diode
Manufacturer
TOSHIBA Semiconductor CORPORATION
Datasheet
1.CMS17.pdf
(5 pages)
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Switching Mode Power Supply Applications
Portable Equipment Battery Applications
•
•
•
•
Maximum Ratings
Electrical Characteristics
Forward voltage: V
Average forward current: I
Repetitive peak reverse voltage: V
Suitable for compact assembly due to a small surface-mount package:
Repetitive peak reverse voltage
Average forward current
Nonrepetitive peak surge current
Junction temperature
Storage temperature range
Peak forward voltage
Peak repetitive reverse current
Junction capacitance
Thermal resistance
(junction to ambient)
Thermal resistance
(junction to lead)
Note: Ta = 77°C
“M−FLAT
Device mounted on a ceramic board
Board size: 50 mm × 50 mm
Soldering size: 2 mm × 2 mm
Board thickness: 0.64 t
Rectangular waveform (α = 180°), V
Characteristic
Characteristic
TM
” (Toshiba package name)”
FM
(Ta = 25°C)
= 0.48 V (max)
F (AV)
= 2.0 A
(Ta = 25°C)
RRM
Symbol
Symbol
I
I
TOSHIBA Schottky Barrier Diode
V
V
R
R
RRM (1)
RRM (2)
I
V
F (AV)
I
T
FM (1)
FM (2)
th (j-a)
th (j-ℓ)
FSM
RRM
C
= 30 V
T
stg
j
j
R
CMS17
= 15 V
I
I
V
V
V
Device mounted on a ceramic board
(board size: 50 mm × 50 mm)
(soldering land: 2 mm × 2 mm)
(board thickness: 0.64 t)
Device mounted on a glass-epoxy
board
(board size: 50 mm × 50 mm)
(soldering land: 6 mm × 6 mm)
(board thickness: 1.6 t)
Device mounted on a glass-epoxy
board
(board size: 50 mm × 50 mm)
(soldering land: 2.1 mm × 1.4 mm)
(board thickness: 1.6 t)
FM
FM
RRM
RRM
R
30 (50 Hz)
2.0 (Note)
−40~150
−40~150
= 10 V, f = 1.0 MHz
= 1.0 A (pulse test)
= 2.0 A (pulse test)
Rating
= 5 V (pulse test)
= 30 V (pulse test)
30
1
Test Condition
⎯
Unit
°C
°C
V
A
A
Weight: 0.023 g (typ.)
JEDEC
JEITA
TOSHIBA
Min
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Typ.
0.42
0.45
0.8
10
90
⎯
⎯
⎯
⎯
3-4E1A
2005-03-03
⎯
⎯
0.48
Max
100
135
210
60
16
⎯
⎯
⎯
CMS17
Unit: mm
°C/W
°C/W
Unit
µA
pF
V
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CMS17 Summary of contents
Page 1
... R th (j-a) (soldering land × 6 mm) (board thickness: 1.6 t) Device mounted on a glass-epoxy board (board size × 50 mm) (soldering land: 2.1 mm × 1.4 mm) (board thickness: 1.6 t) ⎯ (j-ℓ) 1 CMS17 Unit: mm ⎯ JEDEC ⎯ JEITA TOSHIBA 3-4E1A Weight: 0.023 g (typ.) Min Typ. Max Unit ⎯ ...
Page 2
... Thermal resistance between junction and ambient fluctuates depending on the mounting condition of the device. When using the device, design the circuit board and soldering land size to match the appropriate thermal resistance value. 4) Refer to the Rectifiers databook for further information. has a temperature coefficient of 0.1%/°C. Take RRM curve. F (AV) of below 120° CMS17 2005-03-03 ...
Page 3
... Average forward current I r – (j-a) Device mounted on a glass-epoxy board: board size × Soldering land: 6.0 mm × 6.0 mm board thickness: 1.6 t 0.1 0 100 Time t (s) 3 CMS17 – (AV) DC 180° 120° Rectangular waveform α 0° 360° Conduction angle α 1.6 2.0 2.4 2.8 3.2 ...
Page 4
... Rectangular waveform 0.7 0° 360° 0 α 0.5 Conduction angle α 0 150°C 0.3 0.2 0.1 0 160 Reverse voltage V R (V) 4 CMS17 C – V (typ 25° MHz 100 – V (typ 300° 240° 180° 120° 60° 12 ...
Page 5
... CMS17 2005-03-03 ...